Industry Context for Semiconductor Wet Etch and Surface Preparation von Gale, Glenn W.

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Enhancement of semiconductor wafer cleaning by chelating agent addition von GALE, Glenn W, RATH, David L, COOPER, Emanuel I, ESTES, Scott, OKORN-SCHMIDT, Harald F, BRIGANTE, Jeffrey, JAGANNATHAN, R, SETTEMBRE, Greg, ADAMS, Ed

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ROLES OF CAVITATION AND ACOUSTIC STREAMING IN MEGASONIC CLEANING von GALE, GLENN W., BUSNAINA, AHMED A.

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Effects of Wet Chemistry Pre-gate Clean Strategies on the Organic Contamination of Gate Oxides for Metal-Oxide-Semiconductor Field Effect Transistor von Guan, Jay J., Gale, Glenn W., Bennett, Joe

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Removal of Nano-Particles by Aerosol Spray: Effect of Droplet Size and Velocity on Cleaning Performance von Dalmer, Michael, Gale, Glenn W., Podlesnik, D., Wostyn, Kurt, Gaulhofer, E., Xu, K., Springer, C., Mertens, Paul W., Pichler, S., Cado, G., Bearda, Twan

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An experimental study of megasonic cleaning of silicon wafers von BUSNAINA, A. A, KASHKOUSH, I. I, GALE, G. W

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Novel photoresist stripping technology using ozone/vaporized water mixture von Abe, H., Iwamoto, H., Toshima, T., Iino, T., Gale, G.W.

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Insights into Watermark Formation and Control von Orii, Takehiko, Ohno, Hiroki, Namba, Hiromitsu, Gale, Glenn W.

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Dissolution kinetics for atomic, molecular, and ionic contamination from silicon wafers during aqueous processing von SUNI, I. I, GALE, G. W, BUSNAINA, A. A

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Aqueous Cleaning and Surface Conditioning Processes von Reinhardt Karen A, Kern Werner

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Accelerated Removal of Photoresist for Semiconductor Production by an Increased-Pressure Ozone and Water Vapor Process von Shindo, Naoki, Taguchi, Keji, Kitahara, Shigenori, Iino, Tadashi, Toshima, Takayuki, Gale, Glenn W.

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REMOVAL OF SILICA PARTICLES FROM SILICON SUBSTRATES USING MEGASONIC CLEANING von BUSNAINA, AHMED A., GALE, GLENN W.

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Chemical Processing and Materials Compatibility of High-K Dielectric Materials for Advanced Gate Stacks von Guan, J.J., Huff, Howard R., Bersuker, G., Gale, Glenn W., Jackson, M.

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Method and apparatus for pattern collapse free wet processing of semiconductor devices von SYOMIN DENIS, GALE GLENN W, FU QIAN, WILCOXSON MARK H, MIKHAYLICHENKO KATRINA, LIU SHENJIAN

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Aqueous Cleaning and Surface Conditioning Processes von Reinhardt Karen A, Kern Werner

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METHOD AND APPARATUS FOR PATTERN COLLAPSE FREE WET PROCESSING OF SEMICONDUCTOR DEVICES von WILCOXSON, MARK H, MIKHAYLICHENKO, KATRINA, GALE, GLENN W, FU, QIAN, SYOMIN, DENIS, LIU, SHENJIAN

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METHOD AND APPARATUS FOR PATTERN COLLAPSE FREE WET PROCESSING OF SEMICONDUCTOR DEVICES von WILCOXSON, MARK H, MIKHAYLICHENKO, KATRINA, GALE, GLENN W, FU, QIAN, SYOMIN, DENIS, LIU, SHENJIAN

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METHOD OF PROCESSING A WAFER von SYOMIN DENIS, GALE GLENN W, FU QIAN, WILCOXSON MARK H, MIKHAYLICHENKO KATRINA, LIU SHENJIAN

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METHOD AND APPARATUS FOR PATTERN COLLAPSE FREE WET PROCESSING OF SEMICONDUCTOR DEVICES von WILCOXSON, MARK H, MIKHAYLICHENKO, KATRINA, GALE, GLENN W, FU, QIAN, SYOMIN, DENIS, LIU, SHENJIAN

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METHOD AND APPARATUS FOR PATTERN COLLAPSE FREE WET PROCESSING OF SEMICONDUCTOR DEVICES von SYOMIN DENIS, GALE GLENN W, FU QIAN, WILCOXSON MARK H, MIKHAYLICHENKO KATRINA, LIU SHENJIAN

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