300 mm InGaAs-on-insulator substrates fabricated using direct wafer bonding and the Smart Cut™ technology von Widiez, Julie, Sollier, Sébastien, Baron, Thierry, Martin, Mickaël, Gaudin, Gweltaz, Mazen, Frédéric, Madeira, Florence, Favier, Sylvie, Salaun, Amélie, Alcotte, Reynald, Beche, Elodie, Grampeix, Helen, Veytizou, Christelle, Moulet, Jean-Sébastien

Volltext

InGaAs-OI Substrate Fabrication on a 300 mm Wafer von Sollier, Sebastien, Widiez, Julie, Gaudin, Gweltaz, Mazen, Frederic, Baron, Thierry, Martin, Mickail, Roure, Marie-Christine, Besson, Pascal, Morales, Christophe, Beche, Elodie, Fournel, Frank, Favier, Sylvie, Salaun, Amelie, Gergaud, Patrice, Cordeau, Maryline, Veytizou, Christellle, Ecarnot, Ludovic, Delprat, Daniel, Radu, Ionut, Signamarcheix, Thomas

Volltext

150 mm SiC Engineered Substrates for High-Voltage Power Devices von Bhargava, Shivan, Gaudin, Gweltaz, Berre, Guillaume, Schwarzenbach, Walter, Viravaux, Laurent, Bethoux, Jean Marc, Duboust, Alain, Lavaitte, Guillaume, Gelineau, Guillaume, Troutot, Nicolas, Rolland, Emmanuel, Drouin, Alexis, Radu, Ionut, Allibert, Frédéric, Bouville-Lallart, Adeline, Thomas, Shawn, Leow, Yen Lin, Boulet, Romain, Vladimirova, Kremena, Maleville, Christophe, Cela, Enrica, Widiez, Julie, Rouchier, Séverin, Bosch, Daphnée, Servant, Florence, Navone, Christelle, Chapelle, Audrey

Volltext

(Keynote) Low Temperature SmartCutTM Process for 3D Integration von Schwarzenbach, Walter, Reboh, Shay, Ghorbel, Aymen, Gaudin, Gweltaz, Besnard, Guillaume, Mazen, Frédéric, Loup, Virginie, Maitrejean, Sylvain, Brunet, Laurent, Nguyen, Bich-Yen, Maleville, Christophe

Volltext

(Keynote) Low Temperature SmartCut TM Process for 3D Integration von Schwarzenbach, Walter, Reboh, Shay, Ghorbel, Aymen, Gaudin, Gweltaz, Besnard, Guillaume, Mazen, Frédéric, Loup, Virginie, Maitrejean, Sylvain, Brunet, Laurent, Nguyen, Bich-Yen, Maleville, Christophe

Volltext

Method for producing a composite structure comprising a thin monocristalline layer on a carrier substrate von Gaudin, Gweltaz

Volltext bestellen

METHOD FOR PRODUCING A COMPOSITE STRUCTURE COMPRISING A THIN MONOCRISTALLINE LAYER ON A CARRIER SUBSTRATE von GAUDIN, Gweltaz

Volltext bestellen

METHOD FOR PRODUCING A COMPOSITE STRUCTURE COMPRISING A THIN MONOCRISTALLINE LAYER ON A CARRIER SUBSTRATE von Gaudin, Gweltaz

Volltext bestellen

METHOD FOR PRODUCING A COMPOSITE STRUCTURE COMPRISING A THIN MONOCRISTALLINE LAYER ON A CARRIER SUBSTRATE von GAUDIN, Gweltaz

Volltext bestellen

METHOD FOR MANUFACTURING A 3D CIRCUIT WITH SHARED RECRYSTALLISATION AND DOPANT ACTIVATION STEPS von GAUDIN, Gweltaz, REBOH, Shay

Volltext bestellen

METHOD FOR MANUFACTURING A SILICON-CARBIDE-BASED SEMICONDUCTOR STRUCTURE AND INTERMEDIATE COMPOSITE STRUCTURE von Biard, Hugo, Gaudin, Gweltaz

Volltext bestellen

METHOD FOR MANUFACTURING A SILICON-CARBIDE-BASED SEMICONDUCTOR STRUCTURE AND INTERMEDIATE COMPOSITE STRUCTURE von GAUDIN, Gweltaz, BIARD, Hugo

Volltext bestellen

METHOD OF JOINING TWO SEMI-CONDUCTOR SUBSTRATES von FUTIN, Céline, GAUDIN, Gweltaz

Volltext bestellen

HYBRID STRUCTURE FOR A DEVICE WITH SURFACE ACOUSTIC WAVES von HUYET, Isabelle, GAUDIN, Gweltaz

Volltext bestellen

HYBRID STRUCTURE FOR A DEVICE WITH SURFACE ACOUSTIC WAVES von HUYET, Isabelle, GAUDIN, Gweltaz

Volltext bestellen

METHOD OF JOINING TWO SEMI-CONDUCTOR SUBSTRATES von Futin, Céline, Gaudin, Gweltaz

Volltext bestellen

METHOD OF JOINING TWO SEMI-CONDUCTOR SUBSTRATES von FUTIN, Céline, GAUDIN, Gweltaz

Volltext bestellen

Process for manufacturing a composite structure comprising a single-crystal thin layer on a support substrate von GAUDIN, GWELTAZ

Volltext bestellen

PROCEDE DE FABRICATION D'UNE STRUCTURE SEMI-CONDUCTRICE COMPRENANT UNE COUCHE UTILE EN CARBURE DE SILICIUM AUX PROPRIETES ELECTRIQUES AMELIOREES von ROUCHIER, Séverin, DROUIN ALEXIS, DROUIN, Alexis, WIDIEZ, Julie, GAUDIN GWELTAZ, ROLLAND, Emmanuel, GAUDIN, Gweltaz, ROLLAND EMMANUEL, SCHWARZENBACH, Walter, WIDIEZ JULIE, ROUCHIER SÉVERIN, SCHWARZENBACH WALTER

Volltext bestellen

(Invited) Low Temperature Direct Bonding 3D Stacking Technologies for High Density Device Integration von Di Cioccio, Lea, Radu, Ionut, Gaudin, Gweltaz, Lacave, Thomas, Baudin, Floriane, Sadaka, Mariam, Signamarcheix, Thomas

Volltext