A High-Voltage-Isolated MEMS Quad-Solenoid Transformer with Specific Insulation Barriers for Miniaturized Galvanically Isolated Power Applications von Chen, Changnan, Pan, Pichao, Gu, Jiebin, Li, Xinxin

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Double-Deck Metal Solenoids 3D Integrated in Silicon Wafer for Kinetic Energy Harvester von Wang, Nianying, Han, Ruofeng, Chen, Changnan, Gu, Jiebin, Li, Xinxin

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A High-Performance MEMS Accelerometer with an Improved TGV Process of Low Cost von Fu, Yingchun, Han, Guowei, Gu, Jiebin, Zhao, Yongmei, Ning, Jin, Wei, Zhenyu, Yang, Fuhua, Si, Chaowei

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MEMS-Casting Fabricated Chip-Style 3D Metal Solenoidal Transformers towards Integrated Power Supply von Wang, Nianying, Chen, Changnan, Chen, Pu, Gu, Jiebin, Pan, Pichao, Han, Ruofeng, Liu, Min, Li, Xinxin

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Design and Wafer-Level Fabrication of Stacked-Type Transformers for High-Density Power Converters von Chen, Changnan, Pan, Pichao, Gu, Jiebin, Liu, Min, Li, Xinxin

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High-Performance 3-D Silicon-Embedded Coupled Solenoid Inductors With Inserted Magnetic Core von Pan, Pichao, Chen, Changnan, Gu, Jiebin, Liu, Min, Li, Xinxin

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Solder Pump Technology for Through-Silicon via Fabrication von Jiebin Gu, Pike, W T, Karl, W J

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Through-Glass-Via Based Microstrip Band-Pass Filters Fabricated With Wafer-Level Low-Melting-Point Alloy Micro-Casting von Zhang, Weibo, Gu, Jiebin, Li, Lingyun, Li, Xinxin

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Silicon-chip based electromagnetic vibration energy harvesters fabricated using wafer-level micro-casting technique von Han, Ruofeng, Wang, Nianying, Wang, Jiachou, Gu, Jiebin, Li, Xinxin

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Wafer-Level Fabricated Tight-Coupling Dual-Solenoid Transformer Chips With Watt-Scale Power Transfer von Chen, Changnan, Pan, Pichao, Lyu, Dongfeng, Gu, Jiebin, Liu, Min, Li, Xinxin

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On-Wafer Microrectangular Coaxial Delay Line by Using MEMS-Casting Process von Dai, Xinfeng, Che, Wenquan, Gu, Jiebin, Feng, Wenjie

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A novel capillary-effect-based solder pump structure and its potential application for through-wafer interconnection von Gu, Jiebin, Pike, W T, Karl, W J

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Copper/benzocyclotene thin film technique based microstrip bandpass filter featured by thick dielectric layer for low insertion loss von Zhang, Weibo, Gu, Jiebin, Xu, Gaowei, Luo, Le, Li, Xinxin

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Study of a through-silicon/substrate via filling method based on the combinative effect of capillary action and liquid bridge rupture von Gu, Jiebin, Liu, Bingjie, Chen, Gaoli, Li, Xinxin

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An optimized through-via bottom-up method for simultaneous-filling TSVS of different aspect-ratios and its potential application on high-frequency passive interposer von Zhang, Weibo, Gu, Jiebin, Xu, Gaowei, Luo, Le, Li, Xinxin

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A novel vertical solder pump structure for through-wafer interconnects von Jiebin Gu, Pike, W T, Karl, W J

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Isolation transformer, common mode inductor, electronic component and preparation method thereof von GU JIEBIN

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Filling vias during TSV fabrication von GUANGBIN DOU, XUGUO HUANG, WILLIAM THOMAS PIKE, JIEBIN GU

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METHOD FOR PREPARING PATTERNED GRAPHENE von GAO, Boxiang, GU, Jiebin, ZHU, Hongyan, WU, Tianru, ZHANG, Chao

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Circuit board and mobile phone shell von GU JIEBIN, SU QIANYONG

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