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Junction formation and its device impact through the nodes: From single to coimplants, from beam line to plasma, from single ions to clusters, and from rapid thermal annealing to l...
Veröffentlicht in Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena
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Interstitial defects in silicon from 1–5 keV Si+ ion implantation
Veröffentlicht in Applied physics letters
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Fin Doping by Hot Implant for 14nm FinFET Technology and Beyond
Veröffentlicht in ECS transactions
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Sputtering of Si with decaborane cluster ions
Veröffentlicht in Applied physics letters
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