Formation of silicon reentrant cavity heat sinks using anisotropic etching and direct wafer bonding von Goyal, A., Jaeger, R.C., Bhavnani, S.H., Ellis, C.D., Phadke, N.K., Azimi-Rashti, M., Goodling, J.S.

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Co-ordination number distribution of spherical particles in a packed cylindrical bed von Goodling, J.S., Khader, M.S.

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Radial porosity distribution in cylindrical beds packed with spheres von Goodling, J.S., Vachon, R.I., Stelpflug, W.S., Ying, S.J., Khader, M.S.

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Heat sink optimization with application to microchannels von Knight, R.W., Hall, D.J., Goodling, J.S., Jaeger, R.C.

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Rarefied MHD laminar radial channel flow von Khader, M. S., Goodling, J. S., Vachon, R. I.

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A test section for measuring Kapitza resistance von Goodling, J.S.

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Optimal thermal design of air cooled forced convection finned heat sinks-experimental verification von Knight, R.W., Goodling, J.S., Gross, B.E.

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High heat flux cooling for silicon hybrid multichip packaging von Jaeger, R.C., Goodling, J.S., Baginski, M.E., Ellis, C.D., Williamson, N.V., O'Barr, R.M.

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Cooling for high heat flux VLSI systems von Jaeger, R.C., Goodling, J.S.

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DEEP RESERVOIR THERMAL STRATIFICATION MODEL von Goodling, J. S., Arnold, T. G.

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DEEP RESERVOIR THERMAL STRATIFICATION MODEL1 von Goodling, J. S., Arnold, T. G.

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AN EVAPORATION EQUATION FOR AN OPEN BODY OF WATER EXPOSED TO THE ATMOSPHERE von Goodling, J. S., Sill, B. L., McCabe, W. J.

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THE EFFECTS OF DIURNAL MIXING ON THERMAL STRATIFICATION OF STATIC IMPOUNDMENTS von Hirshburg, R. I., Goodling, J. S., Maples, G.

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AN EVAPORATION EQUATION FOR AN OPEN BODY OF WATER EXPOSED TO THE ATMOSPHERE1 von Goodling, J. S., Sill, B. L., McCabe, W. J.

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Magnetohydrodynamic laminar source flow between two parallel disks von Khader, M. S., Goodling, J. S.

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THE EFFECTS OF DIURNAL MIXING ON THERMAL STRATIFICATION OF STATIC IMPOUNDMENTS1 von Hirshburg, R. I., Goodling, J. S., Maples, G.

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THE EFFECTS OF DIURNAL MIXING ON THERMAL STRATIFICATION OF STATIC IMPOUNDMENTS 1 von Hirshburg, R. I., Goodling, J. S., Maples, G.

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Re-entrant cavity surface enhancements for immersion cooling of silicon multichip packages von Phadke, N.K., Bhavnani, S.H., Goyal, A., Jaeger, R.C., Goodling, J.S.

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Magnetohydrodynamic laminar source flow between two parallel disks von Khader, M S, GOODLING, J S

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Re-entrant cavity surface enhancements for immersion cooling of silicon multichip packages von Phadke, N.K., Bhavnani, S.H., Goyal, A., Jaeger, R.C., Goodling, J.S.

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