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  1. 1
    Interleaved and vertically spaced integrated circuit line metallization with different vias and metal selective deposition

    Interleaved and vertically spaced integrated circuit line metallization with different vias and metal selective deposition von CHEN JIUNN-REN, METZ MARKUS, GLENDENNING STUART B, KARPOV ELIJAH, RESHOTKO MICHAEL

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  2. 2
    Integrated circuit with MAX or MX conductive material

    Integrated circuit with MAX or MX conductive material von CHEN JIUNN-REN, NAYLOR CHRISTOPHER H, PENUMAKINGHA ADITYA V, DOROW CHARLES J, CHEBIAM RAMANAN V, METZ MATTHEW V, GLENDENNING STUART B, BIELEFELD JEFFERY D, KOBRINSKY MAURO J, S. LEE, O 'BRIEN KEVIN P, MAXEY KENNETH K, JEZEWSKI CHRISTOPHER J, AVCI UYGAR E

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