Effect of powder characteristics on the microstructure and performance of CuSn10 parts by material extrusion 3D printing von Jin, Kai, Zheng, Su, Li, Gemin, Cheng, Jigui

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Thermal shock behaviors of W/Cu joints with different structures von Wei, Bangzheng, Chen, Ruizhi, Xu, Dang, Li, Gemin, Yang, Guang, Wang, Bing, Chen, Pengqi, Xu, Qiu, Cheng, Jigui

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Preparation of Bronze (CuSn10) Parts by Material Extrusion Process Using Paraffin-Based Binder von Jin, Kai, Li, Gemin, Wei, Bangzheng, Chen, Ruizhi, Chen, Pengqi, Cheng, Jigui

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A comprehensive experimental study of micro-perforated panel acoustic absorbers in MRI scanners von Li, Gemin, Mechefske, Chris K.

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Analysis of an MRI gradient coil duct with a micro-perforated panel acoustic absorber von Li, Gemin, Mechefske, Chris K.

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Structural–acoustic modal analysis of cylindrical shells: application to MRI scanner systems von Li, Gemin, Mechefske, Chris K.

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Battery with electromagnetic interference shielding von Li, Gemin, Ding, Yao, Edwards, Troy

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BATTERY WITH ELECTROMAGNETIC INTERFERENCE SHIELDING von Li, Gemin, Ding, Yao, Edwards, Troy

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Method to Reduce H-Field Coupling for E-noise and a Kind of Non-Coaxial Integrated Earbuds von Li, Gemin, Ding, Yao, Ding, Shengyin, Sun, Guohua, Zhang, Jianmin

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Method to reduce H-field coupling for E-noise and a kind of non-coaxial integrated earbuds von Li, Gemin, Ding, Yao, Ding, Shengyin, Sun, Guohua, Zhang, Jianmin

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Method to Reduce H-Field Coupling for E-noise and A Kind of Non-Coaxial Integrated Earbuds von Li, Gemin, Ding, Yao, Ding, Shengyin, Sun, Guohua, Zhang, Jianmin

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Chemical synthesis of Ub-AMC via ligation of peptide hydrazides von Liang, Jun, Fang, GeMin, Huang, XiuLiang, Mei, ZiQing, Li, Juan, Tian, ChangLin, Liu, Lei

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Printed circuit board assembly having a damping layer von Li, Gemin, Yoo, Sung Woo, Duke, Connor R, Gong, Zhong-Qing, Richardson, Kevin R, Bard, Benjamin A, Martinez, Paul, Kottke, Nelson J, Mead, Curtis C, Poulain, Kieran

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SWITCHED POWER SUPPLY WITH REDUCED NOISE von PATE, Michael Scot, LI, Gemin, LAI-FONG, Hsiao

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STACKED PASSIVE COMPONENT STRUCTURES von Arnold Shawn X, Li Gemin, Choi Won Seop, Rainer Amanda R, Ning Gang, Gong Zhong-Qing, Martinez Paul A

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Pressure detecting indicator von GEMIN LI

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PRINTED CIRCUIT BOARD ASSEMBLY HAVING A DAMPING LAYER von Li Gemin, Bard Benjamin A, Mead Curtis C, Poulain Kieran, Gong Zhong-Qing, Richardson Kevin R, Martinez Paul, Duke Connor R, Kottke Nelson J, Yoo Sung Woo

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Field Efficacy Test of 22% Fipronil FS against Sugarcane Stem Borers and Thrips von Zeping, Wang, Lu, Liu, Hongtao, Jiang, Gemin, Zhang, Weihua, Huang, Qiang, Liang, Weixing, Duan, Yijie, Li, Jinju, Wei, Zhenqiang, Qin, Chenghua, Huang, Shanhai, Lin

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Preparation method of Fe-Cu-C-lubricating component gradient composite antifriction material and corresponding material von LI GEMIN, LI JIAXIN, CHENG JIGUI, CHEN PENGQI, FENG HAN

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Printed Circuit Board Assembly Having A Damping Layer von CURTIS C. MEAD, ZHONG-QING GONG, BENJAMIN A. BARD, SUNG WOO YOO, KEVI R. RICHARDSON, GEMIN LI, NELSON J. KOTTKE, PAUL MARTINEZ, CONNOR R. DUKE, KIERAN POULAIN

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