Use of sub-melt laser annealing and low temperature rapid thermal annealing to form ultrashallow junctions in semiconductor wafers von TALWAR, SOMIT, FELCH, SUSAN B, GELATOS, CAROL M, DOWNEY, DANIEL F

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METHOD OF FORMING ULTRASHALLOW JUNCTIONS BY LASER ANNEALING AND RAPID THERMAL ANNEALING von FELCH, SUSAN, B, TALWAR, SOMIT, DOWNEY, DANIEL, F, GELATOS, CAROL, M

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METHOD OF FORMING ULTRASHALLOW JUNCTIONS BY LASER ANNEALING AND RAPID THERMAL ANNEALING von FELCH, SUSAN, B, TALWAR, SOMIT, DOWNEY, DANIEL, F, GELATOS, CAROL, M

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Semiconductor device, memory cell, and processes for forming them von WOO MICHAEL P, FILIPIAK STANLEY M, O'MEARA DAVID L, FRISA LARRY E, GELATOS CAROL M, NAGY ANDREW G, SPARKS TERRY G, BHAT MOUSUMI, LAGE CRAIG S, ONG T. P, LII YEONG-JYH TOM

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Semiconductor device, memory cell, and processes for forming them von Lage, Craig S, Bhat, Mousumi, Lii, Yeong-Jyh Tom, Nagy, Andrew G, Frisa, Larry E, Filipiak, Stanley M, O'Meara, David L, Ong, T. P, Woo, Michael P, Sparks, Terry G, Gelatos, Carol M

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Process for forming a semiconductor device having an interconnect or conductive film electrically insulated from a conductive member or region von WOO MICHAEL P, FILIPIAK STANLEY M, O'MEARA DAVID L, FRISA LARRY E, GELATOS CAROL M, NAGY ANDREW G, SPARKS TERRY G, BHAT MOUSUMI, LAGE CRAIG S, ONG T. P, LII YEONG-JYH TOM

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