Optical module, backside illuminated photoelectric detector and preparation method of backside illuminated photoelectric detector von YU SHENGTAO, LIU JUN, GE CHONGHU, HAO QINFEN

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CPO optical module packaging structure and wafer level packaging method thereof von YU SHENGTAO, LIU JUN, GE CHONGHU, HAO QINFEN

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CPO optical module assembly based on advanced packaging technology and preparation method thereof von YU SHENGTAO, LIU JUN, GE CHONGHU, DUAN HUANLI, HAO QINFEN

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Photoelectric co-packaging module based on advanced packaging and preparation method thereof von YU SHENGTAO, LIU JUN, GE CHONGHU, HAO QINFEN

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3D silicon-based optical end face coupler and preparation method thereof von YU SHENGTAO, LIU JUN, GE CHONGHU, WU JIANBO, HAO QINFEN

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Semiconductor structure von CHONGHU,WANG GE

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Semiconductor device von ZHENGMING HU, JIANCHAO HUANG, WANDA GAN, CHONGHU GE, FULIANG YANG, WENQIN LI, ZHIXIN KE

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Semiconductor structure and metal oxide semiconductor element production method von CHONGHU,LI GE

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Coarse cereal colored sandwich half-dry noodle preparation method von ZHOU BAILING, LIU SEN, LU XIN, TIAN GE, TIAN ZHIFANG, LI MIN, LIANG XIA, SHI LEI, MU CHONGHU, MENG TINGTING, LIU CHAO

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