Electrodeposition of copper–tin alloy thin films for microelectronic applications von Padhi, Deenesh, Gandikota, Srinivas, Nguyen, Hoa B., McGuirk, Chris, Ramanathan, Sivakami, Yahalom, Joseph, Dixit, Girish

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Advantage of Siconi Preclean over Wet Clean for Pre Salicide Applications Beyond 65nm Node von Jianxin Lei, See-Eng Phan, Xinliang Lu, Chien-Teh Kao, Lavu, K., Moraes, K., Tanaka, K., Wood, B., Biju Ninan, Gandikota, S.

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Novel metal gates for high ? applications von Chang, Mei, Chen, Michael S, David, Anais, Gandikota, Srinivas, Ganguli, Seshadri, Hayden, Brian E, Hung, Steven, Lu, Xinliang, Mormiche, Claire, Noori, Atif

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Novel metal gates for high κ applications von Chang, Mei, Chen, Michael S., David, Anaïs, Gandikota, Srinivas, Ganguli, Seshadri, Hayden, Brian E., Hung, Steven, Lu, Xinliang, Mormiche, Claire, Noori, Atif, Smith, Duncan C. A., Vian, Chris J. B.

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Manufacturable Processes for < 32-nm-node CMOS Enhancement by Synchronous Optimization of Strain-Engineered Channel and External Parasitic Resistances von NOORI, Atif M, BALSEANU, Mihaela, LAUWERS, Anne, LEE, Wen-Chin, JIANXIN LEI, MANDREKAR, Tushar, SCHREUTELKAMP, Robert, SHAH, Kavita, THOMPSON, Scott E, VERHEYEN, Peter, WANG, Ching-Ya, XIA, Li-Qun, BOELEN, Pieter, ARGHAVANI, Reza, COCKBUM, Andrew, DEMUYNCK, Steven, FELCH, Susan, GANDIKOTA, Srinivas, JERRY GELATOS, A, KHANDELWAL, Amit, KITTL, Jorge A

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Effective Work Function Engineering for Aggressively Scaled Planar and Multi-Gate Fin Field-Effect Transistor-Based Devices with High-$k$ Last Replacement Metal Gate Technology von Veloso, Anabela, Chew, Soon Aik, Higuchi, Yuichi, Ragnarsson, Lars-$Å$ke, Simoen, Eddy, Schram, Tom, Witters, Thomas, Van Ammel, Annemie, Dekkers, Harold, Tielens, Hilde, Devriendt, Katia, Heylen, Nancy, Sebaai, Farid, Brus, Stephan, Favia, Paola, Geypen, Jef, Bender, Hugo, Phatak, Anup, Chen, Michael S, Lu, Xinliang, Ganguli, Seshadri, Lei, Yu, Tang, Wei, Fu, Xinyu, Gandikota, Srinivas, Noori, Atif, Brand, Adam, Yoshida, Naomi, Thean, Aaron, Horiguchi, Naoto

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Methods of forming metal chalcogenide pillars von Mullick, Amrita B, Gandikota, Srinivas

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Methods Of Forming Metal Chalcogenide Pillars von Mullick, Amrita B, Gandikota, Srinivas

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Methods of forming metal chalcogenide pillars von Mullick, Amrita B, Gandikota, Srinivas

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HIGH-THROUGHPUT PLASMA LID FOR SEMICONDUCTOR MANUFACTURING PROCESSING CHAMBERS von MUSTAFA, Muhannad, BALUJA, Sanjeev, YANG, Yixiong, GOLCHA, Janisht, GANDIKOTA, Srinivas

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HIGH-THROUGHPUT PLASMA LID FOR SEMICONDUCTOR MANUFACTURING PROCESSING CHAMBERS von Yang, Yixiong, Baluja, Sanjeev, Mustafa, Muhannad, Golcha, Janisht, Gandikota, Srinivas

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(Invited) Conformal Metal Gate Process Technology for 14nm Logic Node and Below von Noori, Atif M, Brand, Adam, Lei, Yu, Chen, Michael, Tang, Wei, Lu, Xinliang, Fu, Xinyu, Ganguli, Seshadri, Anthis, Jeffrey, Thompson, David, Yoshida, Naomi, Xu, Min, Allen, Miller, Yang, Haichun, Gelatos, Jerry, Yu, San-Ho, Chang, Mei, Gandikota, Srinivas

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Seamless gap fill von Yang, Yixiong, Liu, Wei, Gandikota, Srinivas

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Graphene diffusion barrier von Wu, Yong, Nemani, Srinivas D, Mallick, Abhijit Basu, Gandikota, Srinivas

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INTEGRATED DIPOLE REGION FOR TRANSISTOR von Yang, Yixiong, Huang, Tianyi, Ganguli, Seshadri, Ma, Tengzhou, Gandikota, Srinivas

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CONFORMAL MOLYBDENUM DEPOSITION von Yang, Yixiong, Ailihumaer, Tuerxun, Sharma, Yogesh, Ganguli, Seshadri, Gandikota, Srinivas

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CONFORMAL MOLYBDENUM DEPOSITION von YANG, Yixiong, GANGULI, Seshadri, AILIHUMAER, Tuerxun, GANDIKOTA, Srinivas, SHARMA, Yogesh

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METHOD FOR FORMATION OF CONFORMAL ALP SIO2 FILMS von RAMACHANDRAN, Gopi Chandran, BAJAJ, Geetika, GANGULI, Seshadri, GANDIKOTA, Srinivas

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METHOD FOR FORMATION OF CONFORMAL ALD SIO2 FILMS von RAMACHANDRAN, Gopi Chandran, BAJAJ, Geetika, GANGULI, Seshadri, GANDIKOTA, Srinivas

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METHODS FOR PATTERNING SUBSTRATES TO ADJUST VOLTAGE PROPERTIES von HUANG, Tianyi, HUNG, Steven C. H, YANG, Yixiong, GANDIKOTA, Srinivas

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