Treffer 1 - 9 von 9 für Suche 'GALIS SPYRIDON', Suchdauer: 0,55s Treffer weiter einschränken
  1. 1
    Engineering and polarization properties of erbium-implanted lithium niobate films for integrated quantum applications

    Engineering and polarization properties of erbium-implanted lithium niobate films for integrated quantum applications von Kaloyeros, Alex, Dutta, Souryaya, Gallis (Galis), Spyros (Spyridon)

    Veröffentlicht in APL materials

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  2. 2
    STIMULATED CORTICAL RESPONSE

    STIMULATED CORTICAL RESPONSE von MARTINEZ-CONDE, Susana, PAPA RAO, Satyavolu S, CABALLERO, Olivya, GALIS, Spyridon, WHITE, Edward, MACKNIK, Stephen L, CARTER, John N

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  3. 3
    STIMULATED CORTICAL RESPONSE

    STIMULATED CORTICAL RESPONSE von MARTINEZ-CONDE, Susana, PAPA RAO, Satyavolu S, CABALLERO, Olivya, GALIS, Spyridon, WHITE, Edward, MACKNIK, Stephen L, CARTER, John N

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  4. 4
    Hybrid bonding interface for 3-dimensional chip integration

    Hybrid bonding interface for 3-dimensional chip integration von BARTH KARL W, DONATON RICARDO A, PETRARCA KEVIN S, GALIS SPYRIDON, SIDDIQUI SHAHAB

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  5. 5
    Hybrid bonding interface for 3-dimensional chip integration

    Hybrid bonding interface for 3-dimensional chip integration von Barth, Karl W, Donaton, Ricardo A, Galis, Spyridon, Petrarca, Kevin S, Siddiqui, Shahab

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  6. 6
    HYBRID BONDING INTERFACE FOR 3-DIMENSIONAL CHIP INTEGRATION

    HYBRID BONDING INTERFACE FOR 3-DIMENSIONAL CHIP INTEGRATION von BARTH KARL W, DONATON RICARDO A, PETRARCA KEVIN S, GALIS SPYRIDON, SIDDIQUI SHAHAB

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  7. 7
    Hybrid bonding interface for 3-dimensional chip integration

    Hybrid bonding interface for 3-dimensional chip integration von Barth, Karl W, Donaton, Ricardo A, Galis, Spyridon, Petrarca, Kevin S, Siddiqui, Shahab

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  8. 8
    Hybrid bonding interface for 3-dimensional chip integration

    Hybrid bonding interface for 3-dimensional chip integration von BARTH KARL W, DONATON RICARDO A, PETRARCA KEVIN S, GALIS SPYRIDON, SIDDIQUI SHAHAB

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  9. 9
    HYBRID BONDING INTERFACE FOR 3-DIMENSIONAL CHIP INTEGRATION

    HYBRID BONDING INTERFACE FOR 3-DIMENSIONAL CHIP INTEGRATION von BARTH KARL W, DONATON RICARDO A, PETRARCA KEVIN S, GALIS SPYRIDON, SIDDIQUI SHAHAB

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