Electrochemical corrosion and electrochemical migration characteristics of SAC-1Bi-xMn solder alloys in NaCl solution von Medgyes, Bálint, Gharaibeh, Ali, Harsányi, Gábor, Pécz, Béla, Felhősi, Ilona

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Electrochemical migration behaviour of Cu, Sn, Ag and Sn63/Pb37 von Medgyes, Bálint, Illés, Balázs, Harsányi, Gábor

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On the Electrochemical Migration Mechanism of Gold in Electronics—Less Reliable Than Expected? von Medgyes, Bálint, Gharaibeh, Ali, Rigler, Dániel, Harsányi, Gábor

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Polymer Films in Sensor Applications von Harsanyi, Gabor

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The effect of chloride ion concentration on electrochemical migration of copper von Medgyes, Bálint, Zhong, Xiankang, Harsányi, Gábor

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Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics von Medgyes, Bálint, Horváth, Barbara, Illés, Balázs, Shinohara, Tadashi, Tahara, Akira, Harsányi, Gábor, Krammer, Olivér

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Effect of strongly oxidizing environment on whisker growth form tin coating von ILLES, Balázs, HORVATH, Barbara, HARSANYI, Gábor

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Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates von Hurtony, Tamás, Krammer, Oliver, Illés, Balázs, Harsányi, Gábor, Bušek, David, Dušek, Karel

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Vapour phase soldering (VPS) technology: a review von Illés, Balázs, Géczy, Attila, Medgyes, Bálint, Harsányi, Gábor

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Advances in pressure sensing for vapour phase soldering process monitoring von Alaya, Mohamed Amine, Geczy, Attila, Illes, Balazs, Harsányi, Gábor, Bušek, David

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Heating characteristics of convection reflow ovens von ILLES, Balazs, HARSANYI, Gabor

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Effect of different thermocouple constructions on heat-level vapour phase soldering profiles von Alaya, Mohamed Amine, Megyeri, Viktória, Bušek, David, Harsányi, Gábor, Geczy, Attila

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Copper-oxide whisker growth on tin–copper alloy coatings caused by the corrosion of Cu6Sn5 intermetallics von Horváth, Barbara, Illés, Balázs, Shinohara, Tadashi, Harsányi, Gábor

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Effects of high current density on lead-free solder joints of chip-size passive SMD components von Geczy, Attila, Straubinger, Daniel, Kovacs, Andras, Krammer, Oliver, Mach, Pavel, Harsányi, Gábor

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Computer modelling of the laser ablation of polymers von Sinkovics, Bálint, Gordon, Péter, Harsányi, Gábor

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Comparative study on proper thermocouple attachment for vapour phase soldering profiling von Géczy, Attila, Kvanduk, Bíborka, Illes, Balazs, Harsányi, Gábor

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Fractal description of dendrite growth during electrochemical migration von Dominkovics, Csaba, Harsányi, Gábor

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Effect of water condensation on electrochemical migration in case of FR4 and polyimide substrates von Medgyes, Bálint, Illés, Balázs, Harsányi, Gábor

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Investigating direction characteristics of the heat transfer coefficient in forced convection reflow oven von ILLES, Balazs, HARSANYI, Gabor

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Localization factor: A new parameter for the quantitative characterization of surface structure with atomic force microscopy (AFM) von Bonyar, Attila, Molnar, Laszlo Milan, Harsanyi, Gabor

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