Fundamental study of the removal mechanisms of nano-sized particles using brush scrubber cleaning von Xu, K., Vos, R., Vereecke, G., Doumen, G., Fyen, W., Mertens, P. W., Heyns, M. M., Vinckier, C., Fransaer, J., Kovacs, F.

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Particle adhesion and removal mechanisms during brush scrubber cleaning von Xu, K., Vos, R., Vereecke, G., Doumen, G., Fyen, W., Mertens, P. W., Heyns, M. M., Vinckier, C., Fransaer, J.

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A force study of on-chip magnetic particle transport based on tapered conductors von Wirix-Speetjens, R., Fyen, W., Kaidong Xu, Jo De Boeck, Borghs, G.

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Removal of submicrometer particles from silicon wafer surfaces using HF-based Cleaning mixtures von VOS, R, LUX, M, XU, K, FYEN, W, KENENS, C, CONARD, T, MERTENS, P, HEYNS, M, HATCHER, Z, HOFFMAN, M

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Relation between Particle Density and Haze on a Wafer: a New Approach to Measuring Nano-Sized Particles von Lux, Marcel, Vinckier, Chris, Vos, Rita, Vereecke, Guy, Kenis, Karine, Holsteyns, Frank, Xu, Kai Dong, Fyen, Wim, Heyns, Marc, Mertens, Paul W.

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Advances in Immersion Related Defectivity on XT:1250i at IMEC von Meanhoudt, M., Kocsis, M., Stepanenko, N., O'Brien, S., Heuvel, D. Van Den, Vangoidsenhoven, D., Gronheid, R., Benndorf, M., Nafus, K., Fyen, W., Kim, H-W, Kishimura, S., Ronse, K.

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Integration of Cu and low- k dielectrics: effect of hard mask and dry etch on electrical performance of damascene structures von Donaton, R.A., Coenegrachts, B., Maenhoudt, M., Pollentier, I., Struyf, H., Vanhaelemeersch, S., Vos, I., Meuris, M., Fyen, W., Beyer, G., Tokei, Z., Stucchi, M., Vervoort, I., De Roest, D., Maex, K.

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A Force Study in Brush Scrubbing von Vinckier, Chris, Vos, Rita, Vereecke, Guy, Doumen, G., Xu, Kai Dong, Fyen, Wim, Heyns, Marc, Fransaer, Jan, Mertens, Paul W.

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Study of the Carry-over Layer and Its Importance for Wet Processing of Semiconductor Substrates von Fyen, Wim, Mertens, Paul W.

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Saturation effects in TXRF on micro-droplet residue samples von Hellin, David, Fyen, Wim, Rip, Jens, Delande, Tinne, Mertens, Paul W., De Gendt, Stefan, Vinckier, Chris

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Rinsing and Drying Effects on Heterogeneous Substrates von Vos, Rita, Meuris, Marc, Devriendt, K., Fyen, Wim, Heyns, Marc, Mertens, Paul W.

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Point of use HF purification for silicon surface preparation by ion exchange von FYEN, W, MOUCHE, L, MEURIS, M, HEYNS, M. M, ZAHKA, J

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Small-angle scattering of polarized light. VI. Sphere doublets at rest and during shear von Dubois, J., Fyen, W., Rusu, D., Peuvrel-Disdier, E., Navard, P.

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Use of Surfactants for Improved Particle Performance of dHF-Based Cleaning Recipes von Lux, Marcel, Vos, Rita, Singh, R., Chen, Zhe Fei, Hatcher, Z., Xu, Kai Dong, Fyen, Wim, Heyns, Marc, Mertens, Paul W.

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Single wafer cleaning and drying: particle removal via a non-contact, non-damaging megasonic clean followed by a high performance "Rotagoni" dry von Lauerhaas, J., Mertens, P.W., Fyen, W., Kenis, K., Meuris, M., Nicolosi, T., Bran, M., Fraser, B., Franklin, C., Wu, Y., Heyns, M.

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Removal of Nano-Particles by Mixed-Fluid Jet: Evaluation of Cleaning Performance and Comparison with Megasonic von Snow, James, Veltens, T., Eitoku, Atsuro, Vereecke, Guy, Sano, Kenichi, Doumen, G., Fyen, Wim, Wostyn, Kurt, Mertens, Paul W.

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Performance of a Linear Single Wafer IPA Vapour Based Drying System von Arnauts, Sophia, Van Steenbergen, Jan, Vereecke, Guy, Holsteyns, Frank, Doumen, G., Fyen, Wim, Mertens, Paul W.

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Advances in Immersion Related Defectivity on XT von Meanhoudt, M, Kocsis, M, Stepanenko, N, O'Brien, S, Van Den Heuvel, D, Vangoidsenhoven, D, Gronheid, R, Benndorf, M, Nafus, K, Fyen, W, Kim, H-W, Kishimura, S, Ronse, K

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Procedure to Evaluate Particle-Substrate Interaction during Immersion in Liquid von Vos, Rita, Fyen, Wim, Xu, Kai Dong, Heyns, Marc, Vansteenbergen, J., Mertens, Paul W.

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Effect of Transient pH on Particle Deposition during Immersion Rinsing von Vos, Rita, Vereecke, Guy, Fyen, Wim, Xu, Kai Dong, Heyns, Marc, Mertens, Paul W.

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