Soluble high coloration efficiency electrochromic polymers based on (N-phenyl)carbazole, triphenylamine and 9,9-dioctyl-9H-fluorene von Zhang, Yaxin, Liu, Fuhan, Hou, Yanjun, Niu, Haijun

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Low-Cost 1- \mu m Photolithography Technologies for Large-Body-Size, Low-Resistance Panel-Based RDL von Fuhan Liu, Nair, Chandrasekharan, Ito, Hirokazu, DeProspo, Bartlet H., Ravichandran, Siddharth, Akimaru, Hisanori, Hasegawa, Koichi, Tummala, Rao R.

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45 degree polymer micromirror integration for board-level three-dimensional optical interconnects von Wang, Fengtao, Liu, Fuhan, Adibi, Ali

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Organic Damascene Process for 1.5- \mu m Panel-Scale Redistribution Layer Technology Using 5- \mu m-Thick Dry Film Photosensitive Dielectrics von Fuhan Liu, Nair, Chandrasekharan, Kubo, Atsushi, Ando, Tomoyuki, Wei, Frank, Sundaram, Venky, Tummala, Rao R.

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Instrument an Off-Shelf CCD Imaging Sensor Into a Handheld Multispectral Video Camera von Dingrong Yi, Linghua Kong, Fengtao Wang, Fuhan Liu, Sprigle, S, Adibi, A

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Ultraminiaturized WLAN RF Receiver Module in Thin Organic Substrate von Sitaraman, Srikrishna, Suzuki, Yuya, Fuhan Liu, Kumbhat, Nitesh, Sung Jin Kim, Sundaram, Venky, Tummala, Rao

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Electrochromic materials based on novel polymers containing triphenylamine units and benzo[c][1,2,5]thiadiazole units von Ma, Fanghong, Liu, Fuhan, Hou, Yanjun, Niu, Haijun, Wang, Cheng

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Characterization of sub-nanosecond pulse compression based on frequency-detuning SBS von Liu, Fuhan, Wang, Yulei, Cao, Chen, Meng, Zibo, Man, Zhaoyang, Bai, Zhenxu, Lu, Zhiwei

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Design, Modeling, Fabrication and Characterization of 2-5- \mu \text Redistribution Layer Traces by Advanced Semiadditive Processes on Low-Cost Panel-Based Glass Interposers von Hao Lu, Furuya, Ryuta, Sawyer, Brett M. D., Nair, Chandrasekharan, Fuhan Liu, Sundaram, Venky, Tummala, Rao R.

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Conductive Anodic Filament Reliability of Small and Fine-Pitch Through Vias in Halogen-Free Organic Packaging Substrate von Ramachandran, K., Fuhan Liu, Sundaram, V., Tummala, R.

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Electrochromism of novel triphenylamine‐containing polyamide polymers von Liu, Fuhan, Zhang, Yaxin, Yu, Guang, Hou, Yanjun, Niu, Haijun

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The Electrochemical and Combustion Properties of HAN‐ECSP Using Cu 2 O/Cu Electrode von Liu, Fuhan, Guo, Haoqi, Zhang, Jian, Xia, Debin, Yang, Yulin, Lin, Kaifeng

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First Demonstration of Compact, Ultra-Thin Low-Pass and Bandpass Filters for 5G Small-Cell Applications von Ali, Muhammad, Liu, Fuhan, Watanabe, Atom, Raj, P. Markondeya, Sundaram, Venkatesh, Tentzeris, Manos M., Tummala, Rao R.

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Subregion Based Prediction of Residual States in Friction Stir Welding of Dissimilar Metals von Zhang, Zhao, Wang, Binbin, Liu, Yali, Liu, Fuhan, Zhang, Xinyu

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Novel D-A-D conjugated polymers based on tetraphenylethylene monomer for electrochromism von Liu, Fuhan, Cong, Zhongfei, Yu, Guang, Niu, Haijun, Hou, Yanjun, Wang, Cheng, Wang, Shuhong

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A Critical Review of Lithography Methodologies and Impacts of Topography on 2.5-D/3-D Interposers von Liu, Fuhan, Nimbalkar, Pratik, Aslani-Amoli, Nahid, Kathaperumal, Mohanalingam, Tummala, Rao, Swaminathan, Madhavan

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Under COVID-19 the Transformation of Enterprise Strategy — A Case Study of Disney von Liu, Fuhan, Luo, Bingzhu, Zhu, Yanyuan, Wang, Yukun

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Innovative Sub-5- \mu m Microvias by Picosecond UV Laser for Post-Moore Packaging Interconnects von Liu, Fuhan, Khurana, Gaurav, Zhang, Rui, Watanabe, Atom, DeProspo, Bartlet H., Nair, Chandrasekharan, Tummala, Rao R., Swaminathan, Madhavan

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Smaller Microvias for Packaging Interconnects by Picosecond UV Laser With a Nanometer Metal Barrier Layer: A Feasibility Study von Liu, Fuhan, Zhang, Rui, Khurana, Gaurav, Deprospo, Bartlet H., Tummala, Rao R., Swaminathan, Madhavan

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Mechanical Characterization of Ultra-Thin, Flexible Glass Substrates for RF Applications von Sivapurapu, Sridhar, Chen, Rui, Kanno, Kimiyuki, Kakutani, Takenori, Letz, Martin, Liu, Fuhan, Sitaraman, Suresh K., Swaminathan, Madhavan

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