Self-Reinforced Doping Strategy in the Multiscale PMIA Paper for High Mechanical Properties and Insulating Performance von Sun, Kaixuan, Lv, Fangcheng, Zhang, Wenqi, Liu, Yunpeng, Fu, Lvqian, Yang, Rui, Wang, Shenghui, Fan, Sidi, Yu, Xiang

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Cu6Sn5 Morphology Transition and Its Effect on Mechanical Properties of Eutectic Sn-Ag Solder Joints von Yang, Ming, Li, Mingyu, Wang, Ling, Fu, Yonggao, Kim, Jongmyung, Weng, Lvqian

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Growth behavior of Cu₆Sn₅ grains formed at an Sn3.5Ag/Cu interface von Yang, Ming, Li, Mingyu, Wang, Ling, Fu, Yonggao, Kim, Jongmyung, Weng, Lvqian

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Growth behavior of Cu 6Sn 5 grains formed at an Sn3.5Ag/Cu interface von Yang, Ming, Li, Mingyu, Wang, Ling, Fu, Yonggao, Kim, Jongmyung, Weng, Lvqian

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