Reducing airborne molecular contamination by efficient purging of FOUPs for 300-mm wafers-the influence of materials properties von Frickinger, J., Bugler, J., Zielonka, G., Pfitzner, L., Ryssel, H., Hollemann, S., Schneider, H.

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Approach for a Standardized Methodology for Multisite Processing of 300-mm Wafers at R&D Sites von Oechsner, R., Pfeffer, M., Frickinger, J., Schellenberger, M., Roeder, G., Pfitzner, L., Ryssel, H., Fritzsche, M., Kaushik, V., Renaud, D., Danel, A., Claeys, C., Bearda, T., Lering, M., Graef, M., Murphy, B., Walther, H., Hury, S.

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Approach for a Standardized Methodology for Multisite Processing of 300-mm Wafers at R & D Sites von Oechsner, R, Pfeffer, M, Frickinger, J, Schellenberger, M, Roeder, G, Pfitzner, L, Ryssel, H, Fritzsche, M, Kaushik, V, Renaud, D, Danel, A, Claeys, C, Bearda, T, Lering, M, Graef, M, Murphy, B, Walther, H, Hury, S

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FOUP cleaning - FOSB transportation: a challenge for manufacturing on 300 mm wafers von Frickinger, J., Bugler, J., Zielonka, G., Ryssel, H., Hans Dudenhausen, M., Fritzsche, M., Shopbell, M.

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Approach for a Standardized Methodology for Multi-Site Processing of 300mm Wafers at R&D-Sites von Oechsner, R., Frickinger, J., Pfeffer, M., Schellenberger, M., Roeder, G., Pfitzner, L., Ryssel, H., Fritzsche, M., Kaushik, V., Renaud, D., Danel, A., Claeys, C., Bearda, T., Lering, M., Graef, M., Murphy, B., Walther, H., Hury, S.

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FLYING WAFER - A STANDARDISED METHODOLOGY FOR MULTI-SITE PROCESSING OF 300 MM WAFERS AT R&D-SITES von Frickinger, J., Oechsner, R., Schellenberger, M., Pfeffer, M., Pfitzner, L., Ryssel, H., Claeys, C., Claes, M., Bearda, T., Renaud, D., Danel, A., Lering, M., Graef, M., Kaushik, V., Murphy, B., Fritzsche, M., Walther, H., Hury, S.

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