Overview of RFID Technology and Its Applications in the Food Industry von Kumar, P, Reinitz, H.W, Simunovic, J, Sandeep, K.P, Franzon, P.D

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3 gb/s AC coupled chip-to-chip communication using a low swing pulse receiver von Luo, L., Wilson, J.M., Mick, S.E., Jian Xu, Liang Zhang, Franzon, P.D.

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An electronically tunable microstrip bandpass filter using thin-film Barium-Strontium-Titanate (BST) varactors von Nath, J., Ghosh, D., Maria, J.-P., Kingon, A.I., Fathelbab, W., Franzon, P.D., Steer, M.B.

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Molecular electronics: from devices and interconnect to circuits and architecture von Stan, M.R., Franzon, P.D., Goldstein, S.C., Lach, J.C., Ziegler, M.M.

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Nanocell logic gates for molecular computing von Tour, J.M., Van Zandt, W.L., Husband, C.P., Husband, S.M., Wilson, L.S., Franzon, P.D., Nackashi, D.P.

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Energy consumption modeling and optimization for SRAM's von Evans, R.J., Franzon, P.D.

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AC coupled interconnect for dense 3-D ICs von Jian Xu, Mick, S., Wilson, J., Luo, L., Chandrasekar, K., Erickson, E., Franzon, P.D.

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A Bounded and Discretized Nelder-Mead Algorithm Suitable for RFIC Calibration von Wyers, E. J., Steer, M. B., Kelley, C. T., Franzon, P. D.

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Causal reduced-order modeling of distributed structures in a transient circuit Simulator von Mohan, R., Myoung Joon Choi, Mick, S.E., Hart, F.P., Chandrasekar, K., Cangellaris, A.C., Franzon, P.D., Steer, M.B.

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Accurate and Scalable IO Buffer Macromodel Based on Surrogate Modeling von Ting Zhu, Steer, M. B., Franzon, P. D.

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Application Exploration for 3-D Integrated Circuits: TCAM, FIFO, and FFT Case Studies von Davis, W.R., Oh, E.C., Sule, A.M., Franzon, P.D.

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Scaling constraints in nanoelectronic random-access memories von Amsinck, Christian J, Di Spigna, Neil H, Nackashi, David P, Franzon, Paul D

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A 32-Gb/s On-Chip Bus With Driver Pre-Emphasis Signaling von Liang Zhang, Wilson, J.M., Bashirullah, R., Lei Luo, Jian Xu, Franzon, P.D.

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A layout-driven yield predictor and fault generator for VLSI von Dalal, A.R., Franzon, P.D., Lorenzetti, M.J.

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Parallel Transient Simulation of Multiphysics Circuits Using Delay-Based Partitioning von Priyadarshi, S., Saunders, C. S., Kriplani, N. M., Demircioglu, H., Davis, W. R., Franzon, P. D., Steer, M. B.

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NanoCell Electronic Memories von Tour, James M, Cheng, Long, Nackashi, David P, Yao, Yuxing, Flatt, Austen K, St. Angelo, Sarah K, Mallouk, Thomas E, Franzon, Paul D

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A 10.35 mW/GFlop stacked SAR DSP unit using fine-grain partitioned 3D integration von Thorolfsson, T., Lipa, S., Franzon, P. D.

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A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits von Harris, T. R., Priyadarshi, S., Melamed, S., Ortega, C., Manohar, R., Dooley, S. R., Kriplani, N. M., Davis, W. R., Franzon, P. D., Steer, M. B.

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A "defect level versus cost" system tradeoff for electronics manufacturing von Scheffler, M., Franzon, P.D., Troster, G.

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Voltage-Mode Driver Preemphasis Technique For On-Chip Global Buses von Liang Zhang, Wilson, J.M., Bashirullah, R., Luo, L., Jian Xu, Franzon, P.D.

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