Logarithmic conformal field theories via logarithmic deformations von Fjelstad, J., Fuchs, J., Hwang, S., Semikhatov, A.M., Tipunin, I.Yu

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Benefits of reversing the circuit manufacturing and assembly processes for electronic products von Fjelstad, J.

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Interconnection strategies for high-density printed circuits - an overview von Fjelstad, Joseph

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Inspection and Test of Flexible Circuits von Fjelstad, J.

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Sectors of solutions in three-dimensional gravity and black holes von Fjelstad, Jens, Hwang, Stephen

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Novel Uses of Flexible Circuit Technology in High Performance Electronic Applications von DiStefano, T, Fjelstad, J

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CFT description of three-dimensional Kerr–de Sitter spacetime von Fjelstad, Jens, Hwang, Stephen, Månsson, Teresia

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Equivalence of Chern-Simons gauge theory and WZNW model using a BRST symmetry von Fjelstad, Jens, Hwang, Stephen

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Flexible circuitry - technology background and important fundamental issues von Fjelstad, Joseph

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Reliability - A highly important product attribute for the world's poorest consumers von Fjelstad, J

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Solderless assembly of electronic products - a more reliable and more cost effective approach to electronics manufacturing? von Fjelstad, J.

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Novel Uses of Flexible Circuit Technology in High Performance Electronic Applications von DiStefano, T, Fjelstad, J

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Reliable and low cost wafer level packaging. Process description and qualification testing results for wide area vertical expansion (WAVE/sup TM/) package technology von Solberg, V., Light, D., Fjelstad, J.

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Novel uses of flexible circuit technology in high performance electronic applications von DISTEFANO, T, FJELSTAD, J

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Wafer level packaging of compliant, chip size ICs von Fjelstad, Joseph, DiStefano, Thomas, Faraci, Anthony

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Manufacture of high density interconnection substrates by co-lamination of inner layers and programmed interconnection joining layers von Fjelstad, Joseph, Karavakis, Konstantine, Haba, Belgacem

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WAVE/sup TM/ technology for wafer level packaging of ICs von Fjelstad, J.

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Chip scale packaging for modern electronics - Book Review von Fjelstad, J., Ghaffarian, R., Kim, Y.-G.

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Bending and Flexing Design Concerns II - Back to Basics, Part 24 von Fjelstad, J

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The flex files. Tracking flex circuit innovation von Fjelstad, J

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