Surface acoustic wave devices on AlN 3C-SiC Si multilayer structures von Lin, Chih-Ming, Chen, Yung-Yu, Felmetsger, Valery V, Lien, Wei-Cheng, Riekkinen, Tommi, Senesky, Debbie G, Pisano, Albert P

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Piezoelectric aluminum nitride nanoelectromechanical actuators von Sinha, Nipun, Wabiszewski, Graham E., Mahameed, Rashed, Felmetsger, Valery V., Tanner, Shawn M., Carpick, Robert W., Piazza, Gianluca

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Thermally compensated aluminum nitride Lamb wave resonators for high temperature applications von Lin, Chih-Ming, Yen, Ting-Ta, Felmetsger, Valery V., Hopcroft, Matthew A., Kuypers, Jan H., Pisano, Albert P.

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Homogeneity and Thermal Stability of Sputtered Al 0.7 Sc 0.3 N Thin Films von Carmona-Cejas, José Manuel, Mirea, Teona, Nieto, Jesús, Olivares, Jimena, Felmetsger, Valery, Clement, Marta

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Homogeneity and Thermal Stability of Sputtered Al[sub.0.7]Sc[sub.0.3]N Thin Films von Carmona-Cejas, José Manuel, Mirea, Teona, Nieto, Jesús, Olivares, Jimena, Felmetsger, Valery, Clement, Marta

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Homogeneity and Thermal Stability of Sputtered Al0.7Sc0.3N Thin Films von Carmona-Cejas, José Manuel, Mirea, Teona, Nieto, Jesús, Olivares, Jimena, Felmetsger, Valery, Clement, Marta

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Microstructure and temperature coefficient of resistance of thin cermet resistor films deposited from CrSi2–Cr–SiC targets by S-gun magnetron von Felmetsger, Valery V.

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Microstructure and temperature coefficient of resistance of thin cermet resistor films deposited from Cr Si 2 – Cr – Si C targets by S-gun magnetron von Felmetsger, Valery V.

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Micromechanical Resonators: AlN/3C-SiC Composite Plate Enabling High-Frequency and High-Q Micromechanical Resonators (Adv. Mater. 20/2012) von Lin, Chih-Ming, Chen, Yung-Yu, Felmetsger, Valery V., Senesky, Debbie G., Pisano, Albert P.

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Characteristics of AlN Lamb wave resonators with various bottom electrode configurations von Chih-Ming Lin, Yantchev, V., Yung-Yu Chen, Felmetsger, V. V., Pisano, A. P.

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Characterization of aluminum nitride lamb wave resonators operating at 600°C for harsh environment RF applications von Ting-Ta Yen, Chih-Ming Lin, Xu Zhao, Felmetsger, Valery V, Senesky, Debbie G, Hopcroft, Matthew A, Pisano, Albert P

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Sputter deposition of cermet resistor films with low temperature coefficient of resistance von FELMETSGER VALERY V

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HIGH-ADHESIVE BACKSIDE METALLIZATION von FELMETSGER, VALERY

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HIGH-ADHESIVE BACKSIDE METALLIZATION von FELMETSGER, VALERY

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High-adhesive backside metallization von FELMETSGER VALERY

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Controlled sputtering enables better SiCr films von Felmetsger, Valery V

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Permanent adherence of the back end of a wafer to an electrical component or sub-assembly von Felmetsger, Valery

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Permanent adherence of the back end of a wafer to an electrical component or sub-assembly von Felmetsger, Valery V

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Stress adjustment in reactive sputtering von LAPTEV PAVEL N, FELMETSGER VALERY

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Crystal orientation and stress in AC reactively sputtered AlN films on Mo electrodes for electro-acoustic devices von Felmetsger, V.V., Laptev, P.N., Tanner, S.M.

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