A systematic review of AI role in the educational system based on a proposed conceptual framework von Xu, Weiqi, Ouyang, Fan

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The application of AI technologies in STEM education: a systematic review from 2011 to 2021 von Xu, Weiqi, Ouyang, Fan

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A mutual mean teacher framework for cross-domain aspect-based sentiment analysis von Ouyang, Fan, Shen, Bo

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Artificial intelligence in education: The three paradigms von Ouyang, Fan, Jiao, Pengcheng

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Using an integrated probabilistic clustering approach to detect student engagement across asynchronous and synchronous online discussions von Wu, Mian, Ouyang, Fan

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Long-term corrosion behaviors of Hastelloy-N and Hastelloy-B3 in moisture-containing molten FLiNaK salt environments von Ouyang, Fan-Yi, Chang, Chi-Hung, Kai, Ji-Jung

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Manipulating the thermal stability of the {111}-oriented nanotwinned Ag films by ion bombardment von Chang, Leh-Ping, Ouyang, Fan-Yi

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The effects of educational robotics in STEM education: a multilevel meta-analysis von Ouyang, Fan, Xu, Weiqi

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Comparing learners’ knowledge, behaviors, and attitudes between two instructional modes of computer programming in secondary education von Sun, Dan, Ouyang, Fan, Li, Yan, Zhu, Caifeng

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High temperature oxidation behavior of high entropy alloy Al4Co3Cr25Cu10Fe25Ni33 in oxygen-containing atmospheres von Cho, Feng-Yi, Tung, Szu-Wei, Ouyang, Fan-Yi

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Effect of substrate bias on the microstructure and properties of (AlCrSiNbZr)Nx high entropy nitride thin film von Wang, Jian-Jie, Chang, Shou-Yi, Ouyang, Fan-Yi

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Integration of artificial intelligence performance prediction and learning analytics to improve student learning in online engineering course von Ouyang, Fan, Wu, Mian, Zheng, Luyi, Zhang, Liyin, Jiao, Pengcheng

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Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps von Shen, Yu-An, Ouyang, Fan-Yi, Chen, Chih

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The Interfacial Reaction of Ni/In/Ni Sandwich Structure During Solid-State Isothermal Aging von Wang, Yu-Chieh, Ouyang, Fan-Yi

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Effect of substrate bias on the formation of nanotwin and properties in Cu thin films for advanced packaging technology von Chang, Leh-Ping, Chang, Sun-Yi, Ouyang, Fan-Yi

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Improvement of Ag films with highly (111) surface orientation for metal direct bonding technique: Nanotwinned structure and ion bombardment effect von Chang, Leh-Ping, Wang, Jian-Jie, Ouyang, Fan-Yi

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Anisotropic Grain Growth of Al-Si Wire Under Electromigration Tests in Power Devices von Tsau, Yan-Wen, Ouyang, Fan-Yi

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Interfacial reaction of Ni3Sn4 intermetallic compound in Ni/SnAg solder/Ni system under thermomigration von Yang, Yi-Shan, Yang, Chia-Jung, Ouyang, Fan-Yi

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Effects of anisotropic β-Sn alloys on Cu diffusion under a temperature gradient von HSU, Wei-Neng, OUYANG, Fan-Yi

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The role of CT in acute type a aortic intramural hematoma von Yaling, Li, Fan, Ouyang, Xiong, Wuzhi, Chengming, Wang

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