Probing Collective Motions of Terminally Anchored Polymers von Fytas, George, Anastasiadis, Spiros H., Seghrouchni, Rachid, Vlassopoulos, Dimitris, Li, Junbai, Factor, Bradford J., Theobald, Wolfgang, Toprakcioglu, Chris

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Grazing incidence x-ray scattering studies of thin films of an aromatic polyimide von Factor, Bradford J, Russell, Thomas P, Toney, Michael F

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Self-Consistent Field Calculations of Tethered Chains in the Presence of Mobile Homopolymer:  Comparison with Experiment von Wijmans, Christopher M, Factor, Bradford J

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Dielectric Behavior of a Polycarbonate/Polyester Mixture upon Transesterification von Factor, Bradford J, Mopsik, Frederick I, Han, Charles C

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Structure of tethered polymer chains immersed in a solution of mobile polymer von Lee, Lay-Theng, Factor, Bradford J., Rondelez, Francis, Kent, Michael S.

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Near-surface structure of aromatic polyimides: the effect of precursor isomers von Factor, Bradford J., Russell, Thomas P., Toney, Michael F.

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Phase-separation kinetics of mixtures of linear and star-shaped polymers von Factor, Bradford J, Russell, Thomas P, Smith, Barton A, Fetters, Lewis J, Bauer, Barry J, Han, Charles C

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A simple, inexpensive flow indicator for cooling water von Factor, Arnold, Factor, Bradford J

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Effects of mobile polymer concentration and chain length on the structure of tethered chains von Lee, Lay-Theng, Factor, Bradford J., Kent, Michael S., Rondelez, Francis

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CHIP SCALE PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF von FACTOR BRADFORD J, APPELT BERND KARL

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STACKED TYPE CHIP PACKAGE STRUCTURE von FACTOR BRADFORD J, APPELT BERND KARL

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Observation of chain stretching in Langmuir diblock copolymer monolayers von Factor, BJ, Lee, LT, Kent, MS, Rondelez, F

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Chip package structure and stacked type chip package structure von BERND KARL, APPELT, FACTOR, BRADFORD J

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Stacked type chip package structure and stack type chip package structure von FACTOR BRADFORD J, APPELT BERND KARL

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Chip scale package structure and fabrication method thereof von FACTOR BRADFORD J, APPELT BERND KARL

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Stacked type chip package structure von FACTOR BRADFORD J, APPELT BERND KARL

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Chip package structure and stacked type chip package structure von BERND KARL, APPELT, FACTOR, BRADFORD J

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Chip scale package structure, package structure and process thereof von BERND KARL, APPELT, FACTOR, BRADFORD J

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DIRECT NEGATIVE AND OFFSET MASTER PRODUCTION von HOEKSTRA, JAN PIETER, FACTOR, BRADFORD J, PENNINGTON, KEITH SAMUEL

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Direct negative and offset master production von HOEKSTRA, JAN PIETER, FACTOR, BRADFORD J, PENNINGTON, KEITH SAMUEL

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