Heat evolution and nugget formation of resistance spot welding under multi-pulsed current waveforms von Wang, Yaqiong, Rao, Zhenghua, Wang, Fengjiang

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Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints von Wang, Fengjiang, Huang, Ying, Zhang, Zhijie, Yan, Chao

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Mechanical properties of SnBi-SnAgCu composition mixed solder joints using bending test von Wang, Fengjiang, Huang, Ying, Du, Chengchao

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Interfacial Behaviors in Cu/Molten Sn–58Bi/Cu Solder Joints Under Coupling with Thermal and Current Stressing von Wang, Fengjiang, Chen, Hong, Li, Dongyang, Zhang, Zhijie, Wang, Xiaojing

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Interfacial Behavior and Shear Strength of Al-25Si-4Cu-1Mg Joints by Transient Liquid Phase Bonding with Cu as Interlayer von Qi, Kai, Xu, Guo, Wang, Fengjiang

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Improving the electrical and mechanical performances of embedded capacitance materials by introducing tungsten disulfide nanoflakes into the dielectric layer von Wang, Fengwei, Xia, Ruohan, Li, Xinxin, Qin, Jinfang, Shao, Hui, Jian, Gang, Liu, Rui, Wang, Fengjiang, Liu, Huarong

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Microstructural evolution and tensile properties of Sn–Ag–Cu mixed with Sn–Pb solder alloys von Wang, Fengjiang, O’Keefe, Matthew, Brinkmeyer, Brandon

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Recent progress on the development of Sn–Bi based low-temperature Pb-free solders von Wang, Fengjiang, Chen, Hong, Huang, Ying, Liu, Luting, Zhang, Zhijie

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Reactive wetting of Sn0.7Cu– xZn lead-free solders on Cu substrate von Wang, Hongqin, Wang, Fengjiang, Gao, Feng, Ma, Xin, Qian, Yiyu

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In or Ni addition on mechanical properties and interfacial growth in Sn–35Bi–1Ag solder joint during isothermal aging von Chen, Jiawei, Liao, Mingqing, Wang, Fengjiang

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Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface von Ma, Xin, Wang, Fengjiang, Qian, Yiyu, Yoshida, Fusahito

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Elastic and thermodynamic properties of B2-MgX intermetallics: A high throughput first-principles investigation von Liao, Mingqing, Zhou, Fei, Wang, Fengjiang, Liu, Bin, Xu, Chao

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Effect of cooling and aging on microstructure and mechanical properties of Sn -9Zn solder von 王凤江, 黄瑛, 田爽, 张超

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Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition von Wang, Qingfeng, Chen, Hong, Wang, Fengjiang

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FEM simulation on residual stress distribution during diffusion bonding between Ti (C, N) metallic ceramic/interlayer/40Cr steel von Wu Mingfang, Wang Fengjiang, Hu Qingxian, Xu Guoxiang

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μ-Opioid/5-HT4 dual pharmacologically active agents―Efforts towards an effective opioid analgesic with less GI and respiratory side effects (Part I) von LIMING SHAO, FENGJIANG WANG, HEWITT, Michael C, BARBERICH, Timothy J

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Synthesis and pharmacological evaluation of 4-(3,4-dichlorophenyl)-N-methyl-1,2,3,4-tetrahydronaphthalenyl amines as triple reuptake inhibitors von Shao, Liming, Wang, Fengjiang, Malcolm, Scott C., Ma, Jianguo, Hewitt, Michael C., Campbell, Una C., Bush, Larry R., Spicer, Nancy A., Engel, Sharon R., Saraswat, Lakshmi D., Hardy, Larry W., Koch, Patrick, Schreiber, Rudy, Spear, Kerry L., Varney, Mark A.

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Structural, mechanical and thermodynamic properties of Mg24RE5: A first-principles investigation von Liao, Mingqing, Wu, Yuesheng, Zhou, Fei, Liu, Bin, Wang, Fengjiang, Xu, Chao

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CALPHAD aided mechanical properties screening in full composition space of NbC-TiC-VC-ZrC ultra-high temperature ceramics von Liao, Mingqing, Gong, Hongshun, Qu, Nan, Wang, Fengjiang, Zhu, Jingchuan, Liu, Zi-Kui

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P212121-C16: An ultrawide bandgap and ultrahard carbon allotrope with the bandgap larger than diamond von Liao, Mingqing, Maimaitimusha, Jumahan, Zhang, Xueting, Zhu, Jingchuan, Wang, Fengjiang

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