Utilization of wood biomass char in a direct carbon fuel cell (DCFC) system von Ahn, Seong Yool, Eom, Seong Yong, Rhie, Young Hoon, Sung, Yon Mo, Moon, Cheor Eon, Choi, Gyung Min, Kim, Duck Jool

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Application of refuse fuels in a direct carbon fuel cell system von Ahn, Seong Yool, Eom, Seong Yong, Rhie, Young Hoon, Sung, Yon Mo, Moon, Cheor Eon, Choi, Gyung Min, Kim, Duck Jool

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Reaction characteristics of the In-15Pb-5Ag solder with a Au/Ni/Cu pad and their effects on mechanical properties von LEE, Jong-Hyun, EOM, Yong-Seong, CHOI, Kwang-Seong, CHOI, Byung-Seok, YOON, Ho-Gyeong, MOON, Jong-Tae, KIM, Yong-Seog

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Reaction Characteristics of the In-1 5Pb-5Ag Solder with a Au/Ni/Cu Pad and Their Effects on Mechanical Properties von Lee, Jong-Hyun, Eom, Yong-Seong, Choi, Kwang-Seong, Choi, Byung-Seok, Yoon, Ho-Gyeong, Moon, Jong-Tae, Kim, Yong-Seog

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Electrical crosstalk analysis for gigabit optical transceiver module von Sung-Il Kim, Yong-Seong Eom, Byung-Seok Choi, Kwang-Seong Choi, Ho-Gyeong Yun, Jong-Hyun Lee, Jun-Hee Park, Jong-Deok Kim, Jong-Tae Moon

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The Electrochemical Oxidation of Various Carbonaceous Fuels in a Direct Carbon Fuel Cell von Eom, Seong Yong, Ahn, Seong Yool, Rhie, Young Hoon, Sung, Yon Mo, Moon, Cheor Eon, Choi, Gyung Min, Kim, Duck Jool

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Carbon-oxygen generating device and method for producing carbon and oxygen from carbon dioxide using the same von JU, HONG SU, EOM, SEONG YONG, CHOI, GYUNG MIN

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FLIP-CHIP PACKAGE AND ITS MANUFACTURING METHOD von KIM JONG-MIN, EOM YONG SEONG, MUN JONTE

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Alignment jig for optical fiber and alignment method of optical fiber using the same von EOM, YONG SEONG

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High speed printing method and apparatus von HWANG TAE-KYUNG,YANG WOO-SEONG,EOM YONG-IN

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MOLD FOR MICTOSPRING FORMATION AND METHOD FOR FORMING MICROSPRING OF SEMICONDUCTOR PACKAGE USING THE SAME von EOM, YONG SEONG

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METHOD FOR OPTIMIZING MOUNTING AREA OF SEMICONDUCTOR PACKAGE von EOM, YONG SEONG

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IMAGE PREPROCESSING METHOD FOR LICENSE PLATE RECOGNITION AND LICENSE PLATE RECOGNITION SYSTEM USING THEREOF von PARK, JEONG HO, GO, WON KI, KIM, SEO HO, EOM, SEONG YONG, HEO, JAE YOUNG, KIM, HI SEOK

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Optical module package of flip chip bonding and packaging method thereof von MUN, JONG TAE, EOM, YONG SEONG

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Wafer level package for optical device and packaging method thereof von MUN, JONG TAE, EOM, YONG SEONG

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에폭시 / 유리섬유 프리프레그의 경화 공정에 관한 연구 von 김홍경(Hong Kyeong Kim), 엄용성(Yong Seong Eom), 정기모(Ki Mo Chung), 안규종(Kyu Jong Ahn), 차국헌(Kook Heon Char)

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Silicon optical bench for packaging optical switch device optical switch package and method for fabricating the silicon optical bench von CHOI, BYEONG SEOK, LEE, JONG HYEON, YOON, HO GYEONG, EOM, YONG SEONG, PARK, HEUNG U

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Module for aligning optical fiber with MOEMS optical switch device von CHOI, BYEONG SEOK, LEE, JONG HYEON, YOON, HO GYEONG, EOM, YONG SEONG, PARK, HEUNG U

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Internal wavelength locker module with photo diode array and method of manufacturing the same von MUN, JONG TAE, CHOI, GWANG SEONG, CHOI, BYEONG SEOK, LEE, JONG HYEON, YOON, HO GYEONG, EOM, YONG SEONG, PARK, HEUNG U

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APPARATUS FOR RECOVERING AND OPERATING ELB AND RECOVERING AND OPERATING METHOD THEREOF von KIM, SEUNG IL, EOM, SEONG YONG, KIM, TAE SU, RYU, CHANG GUK, LIM, SE JONG, KO, GWAN SEOP

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