A highly efficient thermally controlled loss-tunable long-period fiber grating on corrugated metal substrate von Enboa Wu, Rou-Ching Yang, Kuo-Ching San, Chien-Hung Lin, Alhassen, F., Lee, H.P.

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Mechanical Properties of Ni Sn and Cu Sn Determined by Inverse Method von Li-Jung Tai, Li-Jung Tai, Iting Tsai, Iting Tsai, Enboa Wu, Enboa Wu

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Mechanical properties of intermetallic compounds on lead-free solder by Moiré techniques von TSAI, Iting, WU, Enboa, YEN, S. F, CHUANG, T. H

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Strain-induced thermally tuned long-period fiber gratings fabricated on a periodically corrugated substrate von Chien-Hung Lin, Qun Li, Au, A.A., Yan Jiang, Wu, E., Lee, H.P.

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Behavior of Stitched Laminates under In-Plane Tensile and Transverse Impact Loading von Wu, Enboa, Wang, Jyue

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Modeling white light-emitting diodes with phosphor layers von Kang, Dun-Yen, Wu, Enboa, Wang, Da-Ming

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Identification of impact forces at multiple locations on laminated plates von Wu, Enboa, Yeh, Jung-Cheng, Yen, Ching-Shih

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Response of Composite Laminates to Contact Loads and Relationship to Low-Velocity Impact von Wu, Enboa, Shyu, Kae

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Forward and Inverse Analysis for Impact on Sandwich Panels von Tsai, Cheng-Zorn, Wu, Enboa, Luo, Bin-Horn

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Axial crush of metallic honeycombs von Wu, Enboa, Jiang, Wu-Shung

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Woven glass/epoxy laminates subject to projectile impact von Wu, Enboa, Chang, Ling-Chen

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Wafer-level LED-SiP based mobile flash module and characterization von Lin, Jyh-Rong, Ng, Tuen Yi, Wang, Zhaoxin, Wan, Shan Mei, Wong, Kin Wai, Lu, Ming, Wu, Enboa

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Loading Rate Effect on Woven Glass Laminated Plates by Penetration Force von Wu, Enboa, Chang, Ling-Chen

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Microchip Self-Assembly on a Substrate Using Plasma Treatment von CHANG, Chia-Shou, UANG, Ruoh-Huey, WU, Enboa

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Impact on composite laminated plates: An inverse method von Wu, Enboa, Yeh, Jung-Cheng, Yen, Ching-Shih

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Impact of Unstitched and Stitched Laminates by Line Loading von Wu, Enboa, Liau, Jiunjie

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Penetration into Glass/Epoxy Composite Laminates von Wu, Enboa, Tsai, Cheng-Zorn, Chen, Yung-Chung

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Recent advances in optoelectronic technologies in ASTRI von Shu Yuan, Chen-Jung Tsai, Ming Lu, Lam, S.K., Enboa Wu

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Smooth contact of orthotropic laminates by rigid cylinders von Wu, Enboa, Chao, Jey-Chung, Yen, Ching-Shih

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Study on the effects of wafer thinning and dicing on chip strength von Chen, S., Tsai, C.Z., Wu, E., Shih, I.G., Chen, Y.N.

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