Multi-Level Air Gap Integration for 32/22nm nodes using a Spin-on Thermal Degradable Polymer and a SiOC CVD Hard Mask von Daamen, R., Bancken, P.H.L., Emur Badaroglu, D., Michelon, J., Nguyen, V.H., Verheijden, G.J.A.M., Humbert, A., Waeterloos, J., Yang, A., Cheng, J.K., Chen, L., Martens, T., Hoofman, R.J.O.M.

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