Treffer 1 - 20 von 26 für Suche 'Elers, Steven', Suchdauer: 0,70s Treffer weiter einschränken
  1. 1
    Maori are scum, stupid, lazy : Maori according to Google

    Maori are scum, stupid, lazy : Maori according to Google von Elers, Steven

    Veröffentlicht in Te Kaharoa

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  2. 2
    Film Uniformity in Atomic Layer Deposition

    Film Uniformity in Atomic Layer Deposition von Elers, K.-E., Blomberg, T., Peussa, M., Aitchison, B., Haukka, S., Marcus, S.

    Veröffentlicht in Chemical vapor deposition

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  3. 3
    TiCl4 as a Precursor in the TiN Deposition by ALD and PEALD

    TiCl4 as a Precursor in the TiN Deposition by ALD and PEALD von Elers, Kai-Erik, Winkler, Jerry, Weeks, Keith, Marcus, Steven


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  4. 4
    Physical and electrical characterization of ALCVD TiN and WNxCy used as a copper diffusion barrier in dual damascene backend structures (08.2)

    Physical and electrical characterization of ALCVD TiN and WNxCy used as a copper diffusion barrier in dual damascene backend structures (08.2) von SMITH, Steven, LI, Wei-Min, ELERS, Kai-Erik, PFEIFER, Klaus

    Veröffentlicht in Microelectronic engineering

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  5. 5
    TiCl[sub 4] as a Precursor in the TiN Deposition by ALD and PEALD

    TiCl[sub 4] as a Precursor in the TiN Deposition by ALD and PEALD von Elers, Kai-Erik, Winkler, Jerry, Weeks, Keith, Marcus, Steven


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  6. 6
    Physical and electrical characterization of ALCVD[trademark] TiN and WN sub(x)C sub(y) used as a copper diffusion barrier in dual damascene backend structures (08.2)

    Physical and electrical characterization of ALCVD[trademark] TiN and WN sub(x)C sub(y) used as a copper diffusion barrier in dual damascene backend structures (08.2) von Smith, Steven, Li, Wei-Min, Elers, Kai-Erik, Pfeifer, Klaus

    Veröffentlicht in Microelectronic engineering

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  7. 7
    Physical and electrical characterization of ALCVD™ TiN and WN xC y used as a copper diffusion barrier in dual damascene backend structures (08.2)

    Physical and electrical characterization of ALCVD™ TiN and WN xC y used as a copper diffusion barrier in dual damascene backend structures (08.2) von Smith, Steven, Li, Wei-Min, Elers, Kai-Erik, Pfeifer, Klaus

    Veröffentlicht in Microelectronic engineering

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  8. 8
    Plasma-enhanced deposition of metal carbide films

    Plasma-enhanced deposition of metal carbide films von Elers, Kai-Erik, Wilk, Glen, Marcus, Steven

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  9. 9
    Plasma-enhanced deposition of metal carbide films

    Plasma-enhanced deposition of metal carbide films von ELERS KAI-ERIK, WILK GLEN, MARCUS STEVEN

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  10. 10
    Passivated stoichiometric metal nitride films

    Passivated stoichiometric metal nitride films von ELERS KAI-ERIK, MARCUS STEVEN

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  11. 11
    Passivated stoichiometric metal nitride films

    Passivated stoichiometric metal nitride films von Elers, Kai-Erik, Marcus, Steven

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  12. 12
    PASSIVATED STOICHIOMETRIC METAL NITRIDE FILMS

    PASSIVATED STOICHIOMETRIC METAL NITRIDE FILMS von ELERS KAI-ERIK, MARCUS STEVEN

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  13. 13
    PLASMA-ENHANCED DEPOSITION OF METAL CARBIDE FILMS

    PLASMA-ENHANCED DEPOSITION OF METAL CARBIDE FILMS von ELERS KAI-ERIK, WILK GLEN, MARCUS STEVEN

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  14. 14
    PLASMA-ENHANCED DEPOSITION OF METAL CARBIDE FILMS

    PLASMA-ENHANCED DEPOSITION OF METAL CARBIDE FILMS von EILK, GLEN, MARCUS, STEVEN, ELERS, KAI-ERIK

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  15. 15
    TiCl4 as a precursor in the TiN deposition by ALD and PEALD

    TiCl4 as a precursor in the TiN deposition by ALD and PEALD von ELERS, Kai-Erik, WINKLER, Jerry, MARCUS, Steven


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  16. 16
    Method of forming non-conformal layers

    Method of forming non-conformal layers von Van Nooten, Sebastian E, Maes, Jan Willem, Marcus, Steven, Wilk, Glen, Räisänen, Petri, Elers, Kai-Erik

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  17. 17
    Method of forming non-conformal layers

    Method of forming non-conformal layers von RAEISAENEN PETRI, VAN NOOTEN SEBASTIAN E, ELERS KAI-ERIK, WILK GLEN, MARCUS STEVEN, MAES JAN WILLEM

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  18. 18
    Plasma-enhanced deposition of metal carbide films

    Plasma-enhanced deposition of metal carbide films von MARCUS, STEVEN, ELERS, KAI-ERIK, WILK, GLEN

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  19. 19
    METHOD OF FORMING NON-CONFORMAL LAYERS

    METHOD OF FORMING NON-CONFORMAL LAYERS von RAEISAENEN PETRI, VAN NOOTEN SEBASTIAN E, ELERS KAI-ERIK, WILK GLEN, MARCUS STEVEN, MAES JAN WILLEM

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  20. 20
    Method of forming non-conformal layers

    Method of forming non-conformal layers von RAEISAENEN PETRI, VAN NOOTEN SEBASTIAN E, ELERS KAI-ERIK, WILK GLEN, MARCUS STEVEN, MAES JAN WILLEM

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