Thermo-Mechanical Analysis of Aluminium Silicon Carbide Composite Materials von Ekpu, M.

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Finite element analysis of the effect of fin geometry on thermal performance of heat sinks in microelectronics von Ekpu, M

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Effect of Fins Arrangement on Thermal Performance in Microelectronics Devices von EKPU, M

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Optimisation of a microelectronic assembly package using response surface methodology von Ekpu, M.

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Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device von Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H., Ekpu, M.

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Thermo-Mechanical Analysis of Aluminium Silicon Carbide Composite Materials von EKPU, M

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Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach von Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Ekpu, M.

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Finite Element Analysis of the Effect of Fin Geometry on Thermal Performance of Heat Sinks in Microelectronics von EKPU, M

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Fatigue life analysis of Sn96.5Ag3.0Cu0.5 solder thermal interface material of a chip-heat sink assembly in microelectronic applications von Ekpu, M., Bhatti, R., Okereke, M.I., Otiaba, K.C.

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Effects of thermal interface materials (solders) on thermal performance of a microelectronic package von Ekpu, M., Bhatti, R., Ekere, N., Mallik, S., Otiaba, K.

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Advanced thermal management materials for heat sinks used in microelectronics von Ekpu, M., Bhatti, R., Ekere, N., Mallik, S.

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Thermal effects of die-attach voids location and style on performance of chip level package von Otiaba, K. C., Bhatti, R. S., Ekere, N. N., Mallik, S., Amalu, E. H., Ekpu, M.

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Investigation of effects of heat sinks on thermal performance of microelectronic package von Ekpu, M., Bhatti, R., Ekere, N., Mallik, S., Amalu, E., Otiaba, K.

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Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device von Otiaba, K. C., Bhatti, R. S., Ekere, N. N., Ekpu, M., Adeyemi, J.

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Wellness Attitudes of Secondary School Teachers in Cross River State, Nigeria von Ogunjimi, L O, Ikorok, M M, Yusuf, O O, Ekpu, F S

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The effect of thermal constriction on heat management in a microelectronic application von Ekpu, Mathias, Bhatti, Raj, Okereke, M.I., Mallik, Sabuj, Otiaba, Kenny

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