Thermomechanical stress in solar cells: Contact pad modeling and reliability analysis von Rendler, L.C., Romer, P., Beinert, A.J., Walter, J., Stecklum, S., Kraft, A., Eitner, U., Wiese, S.

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Intermetallic Phase Growth and Reliability of Sn-Ag-Soldered Solar Cell Joints von Schmitt, P., Kaiser, P., Savio, C., Tranitz, M., Eitner, U.

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Thermomechanical deformations in photovoltaic laminates von Paggi, M, Kajari-Schröder, S, Eitner, U

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Characterization of Electrically Conductive Adhesives von Eitner, U., Geipel, T., Holtschke, S.-N., Tranitz, M.

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Mechanical and electrical properties of wave-shaped wires for low-stress interconnection of solar cells von Rendler, L.C., Walter, J., Goldenberg, S., Beinert, A.J., Wiese, S., Eitner, U.

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Weierstraß-type representation of affine spheres von Dorfmeister, J., Eitner, U.

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Bow of Silicon Wafers After In-Line High-Rate Evaporation of Aluminum von Mader, C., Eitner, U., Kajari-Schröder, S., Brendel, R.

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Measuring thermomechanical displacements of solar cells in laminates using digital image correlation von Eitner, U., Kontges, M., Brendel, R.

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Spatial and directional distribution of cracks in silicon PV modules after uniform mechanical loads von Kajari-Schroder, S., Kunze, I., Eitner, U., Kontges, M.

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The impact of ribbon properties on measured peel forces von Eitner, U, Rendler, L.C

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The Mechanical Theory Behind the Peel Test von Eitner, U, Rendler, L.C

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Peel testing of ribbons on solar cells at different angles: Consistent comparison by using adhesive fracture energies von Eitner, U, Rendler, L.C

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TPedge: Progress on cost-efficient and durable edge-sealed PV modules von Mittag, M, Eitner, U, Neff, T

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Cure kinetics of electrically conductive adhesives von Geipel, T, Eitner, U

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Analysis of Grain-Size Distribution and Yield Strength of Interconnector Ribbons and Wires at Different Streching Conditions Using Color Etching von Walter, J, Stegmaier, J, Kraft, A, Eitner, U

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Rapid Calculation of the Backsheet Coupling Gain Using Ray Groups von Pfreundt, A, Mittag, M, Heinrich, M, Eitner, U

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Simultaneous Contacting of Boron and Phosphorus Doped Surfaces with a Single Screen Printing Paste von Huyeng, J, Spribille, A, Garcia Prince, M, Rendler, L.C, Ebert, C, Eitner, U, Clement, F

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Bonnet surfaces and Painlevé equations von Bobenko, Alexander, Eitner, Ulrich

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Shingled cell interconnection: A new generation of bifacial PV-modules von Klasen, N, Mondon, A, Kraft, A, Eitner, U

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Solder joint stability study of wire-based interconnection compared to ribbon interconnection von Walter, J, Rendler, L.C, Ebert, C, Kraft, A, Eitner, U

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