Plasma Printing and Related Techniques - Patterning of Surfaces Using Microplasmas at Atmospheric Pressure von Thomas, Michael, Borris, Jochen, Dohse, Antje, Eichler, Marko, Hinze, Alena, Lachmann, Kristina, Nagel, Krees, Klages, Claus-Peter

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Area-Selective Microplasma Treatment in Microfluidic Channels for Novel Fluid Phase Separators von Eichler, Marko, Nagel, Krees, Hennecke, Philipp, Klages, Claus-Peter

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Low-Temperature Direct Bonding of Borosilicate, Fused Silica, and Functional Coatings von Eichler, Marko, Michel, Benedikt, Hennecke, Philipp, Gabriel, Markus, Klages, Claus-Peter

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Adhesive-Free Bonding of Web-Like Plastic-Metal Combinations at Low Temperatures von Schoenberner, Vinzenz, Lehm, Andreas, Romstedt, Diana, Meyer, Hannes Till, Eichler, Marko

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Parametric studies on droplet generation reproducibility for applications with biological relevant fluids von Wiedemeier, Stefan, Eichler, Marko, Römer, Robert, Grodrian, Andreas, Lemke, Karen, Nagel, Krees, Klages, Claus‐Peter, Gastrock, Gunter

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Surface Preparation and Eutectic Wafer Bonding von Heller, Martin, Zoberbier, Margarete, Fujita, Toma, Eichler, Marko

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Control of Direct Bonding Behavior by Interlayers von Eichler, Marko, Dillmann, Helena, Nagel, Krees, Klages, Claus-Peter

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Area-Selective Microplasma Treatment in Microfluidic Channels for Novel Fluid Phase Separators: Cold Atmospheric Plasmas von EICHLER, Marko, NAGEL, Krees, HENNECKE, Philipp, KLAGES, Claus-Peter

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Temporary Wafer Bonding by Polyelectrolyte Interlayers von Eichler, Marko, Dillmann, Helena, Reim, Leo Clemens, Thomas, Michael, Klages, Claus-Peter

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(Invited) Plasma Activation as a Pretreatment Tool for Low-Temperature Direct Wafer Bonding in Microsystems Technology von Eichler, Marko, Hennecke, Philipp, Nagel, Krees, Gabriel, Markus, Klages, Claus-Peter

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Plasma Process. Polym. 11-12/2012 von Thomas, Michael, Borris, Jochen, Dohse, Antje, Eichler, Marko, Hinze, Alena, Lachmann, Kristina, Nagel, Krees, Klages, Claus-Peter

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Plasma Process. Polym. 11-12/2012 von Thomas, Michael, Borris, Jochen, Dohse, Antje, Eichler, Marko, Hinze, Alena, Lachmann, Kristina, Nagel, Krees, Klages, Claus-Peter

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Or0504-Investigations on the Effect of Dielectric Barrier Discharge (DBD) Treatment as a Preconditioning Method for Low Temperature Silicon Wafer Bonding von Michel, Benedikt, Eichler, Marko, Klages, Claus-Peter

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Plasma Printing and Related Techniques Patterning of Surfaces Using Microplasmas at Atmospheric Pressure: Cold Atmospheric Plasmas von THOMAS, Michael, BORRIS, Jochen, DOHSE, Antje, EICHLER, Marko, HINZE, Alena, LACHMANN, Kristina, NAGEL, Krees, KLAGES, Claus-Peter

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Surface Technology with Cold Microplasmas von Klages, Claus-Peter, Hinze, Alena, Lachmann, Kristina, Berger, Claudia, Borris, Jochen, Eichler, Marko, von Hausen, Margret, Zänker, Antje, Thomas, Michael

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Kinetics of Silanol Condensation for Low-Temperature Direct Bonding von Eichler, Marko, Michel, Benedikt, Thomas, Michael, Klages, Claus-Peter

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Wafer direct bonding with ambient pressure plasma activation von GABRIEL, Markus, JOHNSON, Brad, SUSS, Ralf, REICHE, Manfred, EICHLER, Marko

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Use of micro-plasmas for the production of silicon multilayer structures von Eichler, Marko, Michel, Benedikt, Gabriel, Markus, Klagesdr, Claus-Peter

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Einsatz von Mikroplasmen für die Herstellung von Silizium‐Mehrlagenaufbauten von Eichler, Marko, Michel, Benedikt, Gabriel, Markus, Klages, Claus‐Peter

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Adhesive-free bonding of web-like plastic-metal combinations at low temperatures: Abstract von Mann, Annika, Meyer, Hannes, Lachmann, Kristina, Lehm, Andreas, Romstedt, Diana, Eichler, Marko, Thomas, Michael

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