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  1. 1
    Studies on CO2-based slurries and fluorinated silica and alumina particles for chemical mechanical polishing of copper films

    Studies on CO2-based slurries and fluorinated silica and alumina particles for chemical mechanical polishing of copper films von Visintin, Pamela M, Eichenlaub, Sean K, Portnow, Lauren E, Carbonell, Ruben G, Beaudoin, Stephen P, Schauer, Cynthia K, Desimone, Joseph M


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  2. 2
    Studies on CO[sub 2]-Based Slurries and Fluorinated Silica and Alumina Particles for Chemical Mechanical Polishing of Copper Films

    Studies on CO[sub 2]-Based Slurries and Fluorinated Silica and Alumina Particles for Chemical Mechanical Polishing of Copper Films von Visintin, Pamela M., Eichenlaub, Sean K., Portnow, Lauren E., Carbonell, Ruben G., Beaudoin, Stephen P., Schauer, Cynthia K., DeSimone, Joseph M.


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  3. 3
    Adhesion of alumina particles to thin films

    Adhesion of alumina particles to thin films von COOPER, Kevin, EICHENLAUB, Sean, GUPTA, Anand, BEAUDOIN, Stephen


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  4. 4
    New Insights into Particle Adhesion

    New Insights into Particle Adhesion von Cooper, Kevin, Beaudoin, Stephen, Eichenlaub, Sean, Gupta, Anand

    Veröffentlicht in Solid state phenomena

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