Ancillary Service to the Grid Using Intelligent Deferrable Loads von Meyn, Sean P., Barooah, Prabir, Busic, Ana, Yue Chen, Ehren, Jordan

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Ancillary Service to the Grid Using Intelligent Deferrable Loads von Meyn, Sean, Barooah, Prabir, Bušić, Ana, Chen, Yue, Jordan Ehren

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Ancillary service to the grid from deferrable loads: The case for intelligent pool pumps in Florida von Meyn, Sean, Barooah, Prabir, Busic, Ana, Ehren, Jordan

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Void-free Copper Electrodeposition in High Aspect Ratio, Full Wafer Thickness Through-Silicon Vias with Endpoint Detection von Schmitt, Rebecca P., Menk, Lyle A., Baca, Ehren, Bower, John Eric, Romero, Joseph A., Jordan, Matthew B., Jackson, Nathan, Hollowell, Andrew E.

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Void-free Copper Electrodeposition in Full Wafer Thickness Through-Silicon Vias with a 10:1 Aspect Ratio von Schmitt, Rebecca P., Menk, Lyle Alexander, Baca, Ehren, Jordan, Matthew, Hollowell, Andrew E, Jackson, Nathan, Romero, Joseph A, Bower, John Eric

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(Invited) Through-Silicon Via Copper Plating and Endpoint Detection von Schmitt, Rebecca Pauline, Perez, Carlos R., McDow, Jessica N., McClain, Jaime L., Jordan, Matthew B., Baca, Ehren D., Menk, Lyle Alexander, Hollowell, Andrew E.

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Copper Electrodeposition in High Aspect Ratio Mesoscale Through-Silicon Vias: Scaling from Die Level to Wafer Level Plating von Schmitt, Rebecca Pauline, Menk, Lyle Alexander, Jordan, Matthew, Christopher, Jason, Baca, Ehren Donel, McDow, Jessica, Jackson, Nathan, Hollowell, Andrew E

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Electroless Under Bump Metallurgy Deposition on Batches of Singulated Semiconductor Die von Baca, Ehren D, Jordan, Mathew, Michael, Christopher, Musick, Kate, Hollowell, Andrew E

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Galium pumilum Murray

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