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  1. 1
    Implementation of a Temperature Ramp Rate Requirement and Impact on the Packaging Processes

    Implementation of a Temperature Ramp Rate Requirement and Impact on the Packaging Processes von Hamm, Randy, Whitlock, Daren, Eatinger, Ryan, Stearns, Jeremy, Ringwood, Samuel


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  2. 2
    Implementation of a Temperature Ramp Rate Requirement and Impact on the Packaging Processes

    Implementation of a Temperature Ramp Rate Requirement and Impact on the Packaging Processes von Hamm, Randy, Whitlock, Daren, Eatinger, Ryan, Stearns, Jeremy James, Ringwood, Samuel Lynn


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  3. 3
    Sputter deposition of thin film MIM capacitors on LTCC substrates for RF bypass and filtering applications

    Sputter deposition of thin film MIM capacitors on LTCC substrates for RF bypass and filtering applications von Murray, Jack, Huebner, Wayne, O’Keefe, Matthew J., Wilder, Kristina, Eatinger, Ryan, Kuhn, William, Krueger, Daniel S., Wolf, J. Ambrose


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