Synchronous curable deoxidizing capability of epoxy–anhydride adhesive: Deoxidation quantification via spectroscopic analysis von Jang, Keon‐Soo, Eom, Yong‐Sung, Choi, Kwang‐Seong, Bae, Hyun‐Cheol

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Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging von Jang, Keon‐Soo, Eom, Yong‐Sung, Choi, Kwang‐Seong, Bae, Hyun‐Cheol

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Process window of simultaneous transfer and bonding materials using laser‐assisted bonding for mini‐ and micro‐LED display panel packaging von Eom, Yong‐Sung, Choi, Gwang‐Mun, Jang, Ki‐Seok, Joo, Jiho, Lee, Chan‐mi, Oh, Jin‐Hyuk, Moon, Seok‐Hwan, Choi, Kwang‐Seong

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Collective laser‐assisted bonding process for 3D TSV integration with NCP von Alves Braganca, Wagno, Eom, Yong‐Sung, Jang, Keon‐Soo, Moon, Seok Hwan, Bae, Hyun‐Cheol, Choi, Kwang‐Seong

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Formation of a nano-porous structured Cu layer by selective etching of a brass layer and sinter-bonding to achieve direct Cu–Cu bonding von Lee, Wan-Geun, Choi, Kwang-Seong, Eom, Yong-Sung, Lee, Jong-Hyun

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Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications von Eom, Yong‐Sung, Jang, Keon‐Soo, Son, Ji‐Hye, Bae, Hyun‐Cheol, Choi, Kwang‐Seong

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Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding von Le, Xuan-Luc, Le, Xuan-Bach, Hwangbo, Yuhwan, Joo, Jiho, Choi, Gwang-Mun, Eom, Yong-Sung, Choi, Kwang-Seong, Choa, Sung-Hoon

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Self-Powered Autonomous Wireless Sensor Node by Using Silicon-Based 3D Thermoelectric Energy Generator for Environmental Monitoring Application von Im, Jong-Pil, Kim, Jeong, Lee, Jae, Woo, Ji, Im, Sol, Kim, Yeriaron, Eom, Yong-Sung, Choi, Won, Kim, Jun, Moon, Seung

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Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive von Eom, Yong‐Sung, Choi, Kwang‐Seong, Moon, Seok‐Hwan, Park, Jun‐Hee, Lee, Jong‐Hyun, Moon, Jong‐Tae

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Sn58Bi Solder Interconnection for Low‐Temperature Flex‐on‐Flex Bonding von Lee, Haksun, Choi, Kwang‐Seong, Eom, Yong‐Sung, Bae, Hyun‐Cheol, Lee, Jin Ho

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Fine‐Pitch Solder on Pad Process for Microbump Interconnection von Bae, Hyun‐Cheol, Lee, Haksun, Choi, Kwang‐Seong, Eom, Yong‐Sung

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Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder von Eom, Yong‐Sung, Jang, Keon‐Soo, Moon, Jong‐Tae, Nam, Jae‐Do

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Interconnection Technology Based on InSn Solder for Flexible Display Applications von Choi, Kwang‐Seong, Lee, Haksun, Bae, Hyun‐Cheol, Eom, Yong‐Sung, Lee, Jin Ho

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Characterization of Fluxing and Hybrid Underfills with Micro‐encapsulated Catalyst for Long Pot Life von Eom, Yong‐Sung, Son, Ji‐Hye, Jang, Keon‐Soo, Lee, Hak‐Sun, Bae, Hyun‐Cheol, Choi, Kwang‐Seong, Choi, Heung‐Soap

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Optimization of Material and Process for Fine Pitch LVSoP Technology von Eom, Yong‐Sung, Son, Ji‐Hye, Bae, Hyun‐Cheol, Choi, Kwang‐Seong, Choi, Heung‐Soap

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Novel Bumping and Underfill Technologies for 3D IC Integration von Sung, Ki‐Jun, Choi, Kwang‐Seong, Bae, Hyun‐Cheol, Kwon, Yong‐Hwan, Eom, Yong‐Sung

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Novel Bumping Process for Solder on Pad Technology von Choi, Kwang‐Seong, Bae, Ho‐Eun, Bae, Hyun‐Cheol, Eom, Yong‐Sung

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Novel Bumping Material for Solder‐on‐Pad Technology von Choi, Kwang‐Seong, Chu, Sun‐Woo, Lee, Jong‐Jin, Sung, Ki‐Jun, Bae, Hyun‐Cheol, Lim, Byeong‐Ok, Moon, Jong‐Tae, Eom, Yong‐Sung

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Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications von Lee, Haksun, Eom, Yong-Sung, Bae, Hyun-Cheol, Choi, Kwang-Seong, Lee, Jin Ho

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Curing Kinetics and Chemorheological Behavior of No‐flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications von Eom, Yong‐Sung, Son, Ji‐Hye, Bae, Hyun‐Cheol, Choi, Kwang‐Seong, Lee, Jin‐Ho

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