Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging von Bhogaraju, Sri Krishna, Conti, Fosca, Kotadia, Hiren R., Keim, Simon, Tetzlaff, Ulrich, Elger, Gordon

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Precise Adverse Weather Characterization by Deep-Learning-Based Noise Processing in Automotive LiDAR Sensors von Kettelgerdes, Marcel, Sarmiento, Nicolas, Erdogan, Hüseyin, Wunderle, Bernhard, Elger, Gordon

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Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics von Schmid, Maximilian, Bhogaraju, Sri Krishna, Liu, E., Elger, Gordon

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Transient thermal analysis as measurement method for IC package structural integrity von Hanss, Alexander, Schmid, Maximilian, Liu, E, Elger, Gordon

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In-Field Measurement and Methodology for Modeling and Validation of Precipitation Effects on Solid-State LiDAR Sensors von Kettelgerdes, Marcel, Elger, Gordon

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Residual free solder process for fluxless solder pastes von Hanss, Alexander, Elger, Gordon

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Static multi-target-based auto-calibration of RGB cameras, 3D Radar, and 3D Lidar sensors von Agrawal, Shiva, Bhanderi, Savankumar, Doycheva, Kristina, Elger, Gordon

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Influence of heat pipe assisted terminal cooling on the thermal behavior of a large prismatic lithium-ion cell during fast charging in electric vehicles von Kleiner, Jan, Singh, Randeep, Schmid, Michael, Komsiyska, Lidiya, Elger, Gordon, Endisch, Christian

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A New Noise-Suppression Algorithm for Transient Thermal Analysis in Semiconductors Over Pulse Superposition von Schmid, Maximilian, Bhogaraju, Sri Krishna, Hanss, Alexander, Elger, Gordon

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Thermal Modelling of a Prismatic Lithium-Ion Cell in a Battery Electric Vehicle Environment: Influences of the Experimental Validation Setup von Kleiner, Jan, Komsiyska, Lidiya, Elger, Gordon, Endisch, Christian

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Hybrid Cu sinter paste for low temperature bonding of bare semiconductors von Elger, Gordon, Krishna Bhogaraju, Sri, Schneider-Ramelow, Martin

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Multi-Sensor Data Fusion for Real-Time Multi-Object Tracking von Senel, Numan, Kefferpütz, Klaus, Doycheva, Kristina, Elger, Gordon

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Solder joint lifetime model using AI framework operating on FEA data von Zubair Akhtar, Mohd, Schmid, Maximilian, Zippelius, Andreas, Elger, Gordon

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Decomposition mechanism and morphological evolution of realized Cu nanoparticles in Cu complex inks von Mohan, Nihesh, Ahuir-Torres, Juan Ignacio, Bhogaraju, Sri Krishna, Webler, Ralf, Kotadia, Hiren R, Erdogan, Huseyin, Elger, Gordon

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Investigation of stress relaxation in SAC305 with micro-Raman spectroscopy von Liu, E, Bhogaraju, Sri Krishna, Wunderle, Bernhard, Elger, Gordon

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Characterization of tin-oxides and tin-formate crystals obtained from SnAgCu solder alloy under formic acid vapor von Mokhtari, Omid, Conti, Fosca, Bhogaraju, Sri Krishna, Meier, Markus, Schweigart, Helmut, Tetzlaff, Ulrich, Elger, Gordon

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Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor von Conti, Fosca, Hanss, Alexander, Mokhtari, Omid, Bhogaraju, Sri Krishna, Elger, Gordon

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Thermal behavior of intelligent automotive lithium-ion batteries: Operating strategies for adaptive thermal balancing by reconfiguration von Kleiner, Jan, Lechermann, Lorenz, Komsiyska, Lidiya, Elger, Gordon, Endisch, Christian

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Thermal behavior of intelligent automotive lithium-ion batteries: Experimental study with switchable cells and reconfigurable modules von Kleiner, Jan, Heider, Alexander, Komsiyska, Lidiya, Elger, Gordon, Endisch, Christian

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The influence of the phosphor layer as heat source and up-stream thermal masses on the thermal characterization by transient thermal analysis of modern wafer level high power LEDs von Liu, E, Hanss, Alexander, Schmid, Maximilian, Elger, Gordon

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