Plasma chemistry and growth of nanosized particles in a C2H2 RF discharge von Stoykov, S, Eggs, C, Kortshagen, U

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The role of percolation threshold for the control of the hardness and thermal stability of super- and ultrahard nanocomposites von Niederhofer, A, Bolom, T, Nesladek, P, Moto, K, Eggs, C, Patil, D.S, Veprek, S

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Thermal stability of ZrN–Ni and CrN–Ni superhard nanocomposite coatings von Karvánková, P, Männling, H.-D, Eggs, C, Veprek, S

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Structural studies of ITO thin films with the Rietveld method von QUAAS, M, EGGS, C, WULFF, H

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Influence of Al on resistance and power durability of Cu-based SAW metallizations von Spindler, M, Menzel, S B, Eckert, J, Eggs, C

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TEM investigation of Ti and Ti/Al bilayer as alternative diffusion barriers for Cu metallization for SAW device applications von Spindler, M., Menzel, S.B., Eggs, C., Thomas, J., Gemming, T., Eckert, J.

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Photoluminescence from silsesquioxanes R8(SiO1.5)8 von AZINOVIC, D, CAI, J, EGGS, C, KÖNIG, H, MARSMANN, H. C, VEPREK, S

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Thin film deposition by reactive magnetron sputtering: On the influence of target oxidation and its effect on surface properties von Rohde, D., Kersten, H., Eggs, C., Hippler, R.

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Process control of RF plasma assisted surface cleaning von Steffen, H, Schwarz, J, Kersten, H, Behnke, J.F, Eggs, C

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Investigation of the titanium silicide formation in plasma activated physical vapour deposition von Wulff, H., Klimke, J., Steffen, H., Eggs, C.

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Deposition of titanium in a hollow cathode arc discharge: correlation between deposition conditions and film properties von Steffen, H., Eggs, C., Kersten, H.

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Plasma wall interaction for TiNx film deposition in a hollow cathode arc discharge von Eggs, C., Kersten, H., Wagner, H.-E., Wulff, H.

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The effect of annealing conditions on the red photoluminescence of nanocrystalline Si/SiO2 films von XIAOCHUN WU, BEK, Alpan, BITTNER, Alexander M, EGGS, Ch, OSSADNIK, Ch, VEPREK, S

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Kinetic oscillations of red photoluminescence from nanocrystalline Si/SiO2 films von Wu, Xiaochun, Bittner, Alexander M., Kern, Klaus, Eggs, Ch, Veprek, S.

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3D stack packaging solution for BAW devices: 3D packaging demonstrator and RF performance von Sun, X., Posada, G., Majeed, B., Zhang, W., De Raedt, W., Diekmann, C., Eggs, C., Schmidhammer, E.

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Investigations on Plasma Assisted Surface Cleaning of Aluminum in an Oxygen Glow Discharge von Kersten, H., Behnke, J. F., Eggs, C.

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Low energy ion bombardment of Ti and TiNx films von EGGS, C, WULFF, H, HIPPLER, R

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Plasma chemistry and growth of nanosized particles in a C 2 H 2 RF discharge von Stoykov, S, Eggs, C, Kortshagen, U

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Studies of SiGe alloy surfaces after reactive ion etching von Richter, H. H., Wolff, A., Tillack, B., Krüger, D., Höppner, K., Eggs, C.

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Photoluminescence from silsesquioxanes R 8(SiO 1.5) 8 von Azinović, D, Cai, J, Eggs, C, König, H, Marsmann, H.C, Vepřek, S

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