Vapor phase infiltration of aluminum oxide into benzocyclobutene-based polymer dielectrics to increase adhesion strength to thin film metal interconnects von Dwarakanath, Shreya, Raj, Pulugurtha Markondeya, Kondekar, Neha, Losego, Mark D., Tummala, Rao

Volltext

Characterization of emerging polymer dielectric materials for advanced packaging applications von Dwarakanath, Shreya, Bhaskar, Pragna, Kanno, Kimiyuki, Nimbalkar, Pratik C, Kathaperumal, Mohanalingam, Pulugurtha, Markondeya Raj, Swaminathan, Madhavan, Tummala, Rao R

Volltext

Reliability of Fine-Pitch <5- μ m-Diameter Microvias for High-Density Interconnects von Dwarakanath, Shreya, Kakutani, Takenori, Okamoto, Daichi, Raj, Pulugurtha Markondeya, Swaminathan, Madhavan, Tummala, Rao R.

Volltext

Reliability of Fine-Pitch μm-Diameter Microvias for High-Density Interconnects von Dwarakanath, Shreya, Kakutani, Takenori, Okamoto, Daichi, Raj, Pulugurtha Markondeya, Swaminathan, Madhavan, Tummala, Rao R.

Volltext

Electrodeposited Copper-Graphite Composites for Low-CTE-Integrated Thermal Structures von Dwarakanath, Shreya, Raj, P. Markondeya, Demir, Kaya, Smet, Vanessa, Sundaram, Venky, Tummala, Rao

Volltext

Advanced Low-K Polymer Dielectric Materials and Interfaces for Fine-Pitch Re-Distribution-Layer (RDL) to Enable 2.5D and Fan-out Packages von Dwarakanath, Shreya, Raj, Pulugurtha Markondeya, Losego, Mark D., Tummala, Rao R

Volltext

Electrodeposited copper-graphite composites for low-CTE integrated thermal structures von Dwarakanath, Shreya, Raj, P. Markondeya, Demir, Kaya, Smet, Vanessa, Sundaram, Venky, Tummala, Rao

Volltext