Consideration of different heating lengths of needles with induction heating and resistance system: A novel design of needle module for thermal ablation von Bui, Huy‐Tien, Hwang, Sheng‐Jye, Lee, Huei‐Huang, Huang, Durn‐Yuan

Volltext

Study on Induction Heating Coil for Uniform Mold Cavity Surface Heating von Sung, Yu-Ting, Hwang, Sheng-Jye, Lee, Huei-Huang, Huang, Durn-Yuan

Volltext

Modeling of Viscoelastic Behavior of an Epoxy Molding Compound During and After Curing von LIN, Yeong-Jyh, HWANG, Sheng-Jye, LEE, Huei-Huang, HUANG, Durn-Yuan

Volltext

Development of an external-type microinjection molding module for thermoplastic polymer von Chang, Pei-Chi, Hwang, Sheng-Jye, Lee, Huei-Huang, Huang, Durn-Yuan

Volltext

Effects of defrosting period on mold adhesion force of epoxy molding compound von Chen, Hwe-Zhong, Lee, Wen-Hung, Lee, Huei-Huang, Huang, Durn-Yuan, Chang, Shyang-Jye, Hwang, Sheng-Jye

Volltext

Development of Liquid Spray Process in a Rapid Prototyping Machine von Lee, Huei Huang, Huang, Durn Yuan, Hwang, Sheng Jye, Huang, Chi Hua

Volltext

Application of Dynamic Masking on Rapid Prototyping von Chen, Chien Nan, Lee, Huei Huang, Hwang, Sheng Jye, Huang, Durn Yuan

Volltext

Study of P-V-T-C Relation of EMC von Chang, Yi-San, Hwang, Sheng-Jye, Lee, Huei-Huang, Huang, Durn-Yuan

Volltext

Prediction of paddle shift via 3-D TSOP modeling von Su, F., Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang

Volltext

Volume Shrinkage Characterization of Underfill Materials von DENG, Shang-Shiuan, HO, Chia-Yi, LEE, Huei-Huang, HWANG, Sheng-Jye, HUANG, Durn-Yuan

Volltext

Simulation of warpage considering both thermal and cure induced shrinkage during molding in IC packaging von HONG, Li-Ching, HWANG, Sheng-Jye, LEE, Huei-Huang, HUANG, Durn-Yuan

Volltext bestellen

Flow characteristics of laminar separation on surface-mounted ribs von Hsieh, Shou-Shing, Huang, Durn-Yuan

Volltext

On mold corner effects of EMC adhesion for IC encapsulation process von Chia-Hsun Yeh, Chen-hung Deng, Huei-Huang Lee, Sheng-Jye Hwang, Durn-Yuan Huang

Volltext

Warpage simulations with P-V-T-C equation and experiments of fan-out wafer level package after encapsulation process von Shang-Shiuan Deng, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang, Geng-Shin Shen

Volltext

Simulation and experiments of fan-out wafer level package during encapsulation von Shang-Shiuan Deng, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang, Yu-Ren Chen, Geng-Shin Shen

Volltext

Design and Development of Oral Appliance for Obstructive Sleep Apnea von Lee, Huei Huang, Chang, Yi San, Lai, Yu Bin, Huang, Durn Yuan, Hwang, Sheng Jye

Volltext

NUMERICAL COMPUTATION OF LAMINAR SEPARATED FORCED CONVECTION ON SURFACE-MOUNTED RIBS von Hsieh, Shou-Shing, Huang, Durn-Yuan

Volltext

ANALYSIS OF NATURAL CONVECTION IN A CYLINDRICAL ENCLOSURE von Huang, Durn-Yuan, Hsieh, Shou-Shing

Volltext

Prediction of Process Induced Warpage of Electronic Package by P-V-T-C Equation and Taguchi Method von Jian-Yu Chen, Shiang-Yu Teng, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang

Volltext bestellen

Heating system von Lee, Huei-Huang, Hwang, Sheng-Jye, Lin, Yu-Hsien, Chang, Yi-San, Bui, Huy-Tien, Huang, Durn-Yuan, Lin, Xi-Zhang

Volltext bestellen