Copper plating for 3D interconnects von Radisic, A., Lühn, O., Philipsen, H.G.G., El-Mekki, Z., Honore, M., Rodet, S., Armini, S., Drijbooms, C., Bender, H., Ruythooren, W.

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Surface contamination and electrical damage by focused ion beam: conditions applicable to the extraction of TEM lamellae from nanoelectronic devices von Bender, H, Franquet, A, Drijbooms, C, Parmentier, B, Clarysse, T, Vandervorst, W, Kwakman, L

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Structural characterization of through silicon vias von Bender, H., Drijbooms, C., Van Marcke, P., Geypen, J., Philipsen, H. G. G., Radisic, A.

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Materials characterization of WNxCy, WNx and WCx films for advanced barriers von Volders, H, Tokei, Z, Bender, H, Brijs, B, Caluwaerts, R, Carbonell, L, Conard, T, Drijbooms, C, Franquet, A, Garaud, S, Hoflijk, I, Moussa, A, Sinapi, F, Travaly, Y, Vanhaeren, D, Vereecke, G, Zhao, C, Li, W-M, Sprey, H

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TSV Cu Plating and Implications for CMP von Radisic, Aleksandar, Philipsen, Harold, Honore, Mia, Wang, Yu-Shuen, Heylen, Nancy, El-Mekki, Zaid, Armini, Silvia, Vandersmissen, Kevin, Rodet, Simon, Van Ammel, Annemie, Bender, Hugo, Drijbooms, Christel, Vanstreels, Kris, Ruythooren, Wouter

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Degradation and failure analysis of copper and tungsten contacts under high fluence stress von Kauerauf, T, Butera, G, Croes, K, Demuynck, S, Wilson, C J, Roussel, P, Drijbooms, C, Bender, H, Lofrano, M, Vandevelde, B, Tökei, Zsolt, Groeseneken, G

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Selective Epitaxy of Si/SiGe to Improve pMOS Devices by Recessed Source/Drain and/or Buried SiGe Channels von Loo, Roger, Verheyen, Peter, Rooyackers, Rita, Walczyk, Christian, Leys, Frederik, Shamiryan, Denis, Absil, Philip, Delande, Tinne, Moussa, Alain, Weijtmans, Hans, Wise, Rick, Machkaoutsan, Vladimir, Arena, Chantal, McCormack, John, Passefort, Sophie, Sorada, Haruyuki, Inoue, Akira, Lee, Byeong Chan, Hyun, Sangjin, Jakschik, Stefan, Caymax, Matty R., Eneman, Geert, Bender, Hugo, Drijbooms, Chris, Geenen, Luc, Tomasini, Pierre, Godny, Stephane

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Materials characterization of WN x C y , WN x and WC x films for advanced barriers von Volders, H., Tökei, Z., Bender, H., Brijs, B., Caluwaerts, R., Carbonell, L., Conard, T., Drijbooms, C., Franquet, A., Garaud, S., Hoflijk, I., Moussa, A., Sinapi, F., Travaly, Y., Vanhaeren, D., Vereecke, G., Zhao, C., Li, W.-M., Sprey, H., Jonas, A.M.

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Materials characterization of WNxCy, WNxand WCx films for advanced barriers von VOLDERS, H, TOKEI, Z, HOFLIJK, I, MOUSSA, A, SINAPI, F, TRAVALY, Y, VANHAEREN, D, VEREECKE, G, ZHAO, C, LI, W.-M, SPREY, H, JONAS, A. M, BENDER, H, BRIJS, B, CALUWAERTS, R, CARBONELL, L, CONARD, T, DRIJBOOMS, C, FRANQUET, A, GARAUD, S

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3D-carrier profiling in FinFETs using scanning spreading resistance microscopy von Mody, J., Zschatzsch, G., Kolling, S., De Keersgieter, A., Eneman, G., Kambham, A. K., Drijbooms, C., Schulze, A., Chiarella, T., Horiguchi, N., Hoffmann, T-Y, Eyben, P., Vandervorst, W.

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Scanning spreading resistance microscopy for carrier profiling beyond 32nm node von Mody, J., Zschatzsch, G., Kolling, S., De Keersgieter, A., Eneman, G., Kambham, A. K., Drijbooms, C., Schulze, A., Chiarella, T., Horiguchi, N., Eyben, P., Vandervorst, W.

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Ferroelectricity in Si-Doped Hafnia: Probing Challenges in Absence of Screening Charges von Celano, Umberto, Gomez, Andres, Piedimonte, Paola, Neumayer, Sabine, Collins, Liam, Popovici, Mihaela, Florent, Karine, McMitchell, Sean R. C., Favia, Paola, Drijbooms, Chris, Bender, Hugo, Paredis, Kristof, Di Piazza, Luca, Jesse, Stephen, Van Houdt, Jan, van der Heide, Paul

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Planificateur ou formulateur ? Mise en évidence de deux stratégies de rédaction à partir d’un support imagé chez des élèves de CE1 et de CM2 von Alamargot, Denis, Morin, Marie-France, Drijbooms, Elise

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Le déjà-là dans l'écriture von Alamargot, Denis, Bernard Barbeau, Geneviève, Biardzka, Elżbieta, Boré, Catherine, Bourhis, Véronique, Bozhinova, Krastanka, Castagnet-Caignec, Sonia, Crinon, Jacques, Delarue-Breton, Catherine, Delavigne, Valérie, Drijbooms, Elise, Frossard, Danièle, Fuchs, Catherine, Jorge, Muriel, Leblay, Christophe, Leblay, Tarja, Marin, Brigitte, Morin, Marie-France, Mutta, Maarit, Narcy-Combes, Jean-Paul, Panchout, Martine, Pereira, Marie-Emmanuelle, Plane, Sylvie, Rey, Véronique, Romain, Christina, Rondelli, Fabienne, Sève, Pierre, Similowski, Kathy, Testenoire, Pierre-Yves, Vénérin-Guénez, Christine, Zaouali, Sonia

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The Role of Additives and Deposition Parameters in Cu Plating of High Aspect Ratio Vias von Ko, Ted, Radisic, Aleksandar, Armini, Silvia, Vereecken, Philippe M., Drijbooms, Christel, Bender, Hugo, Sun, Sey-Ping, Wann, Clement, Yu, C. H., Leunissen, Peter, Ruythooren, Wouter, Vanhaelemeersch, Serge

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