A 12.8-Gb/s/link Tri-Modal Single-Ended Memory Interface von Amirkhany, Amir, Wei, Jason, Mishra, Navin Kumar, Jie Shen, Beyene, Wendemagegnehu T., Chen, Catherine, Chin, T. J., Dressier, Deborah, Huang, Charlie, Gadde, Vijay P., Hekmat, Mohammad, Kaviani, Kambiz, Hai Lan, Phuong Le, Mahabaleshwara, Madden, Chris, Mukherjee, Sanku, Raghavan, Leneesh, Saito, Keisuke, Secker, Dave, Sendhil, Arul, Schmitt, Ralf, Fazeel, Shuaeb, Srinivas, Gundlapalli Shanmukha, Ting Wu, Chanh Tran, Vaidyanath, Arun, Vyas, Kapil, Ling Yang, Jain, Manish, Chang, Kun-Yung Ken, Xingchao Yuan

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Low power and low EM emission DRAM memory interface for HD video recording in mobile devices von Yip, Tsunwai Gary, Dressler, Deborah, Tsang, Brian, Torres, Adrian, Yeung, Philip

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The effects of signal layer positions in multi-layer PCB designs von Fan, J., Knighten, J.L., Smith, N.W., Alexander, R., Dressier, D.

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