Bipolar Conduction across a Wafer Bonded p-n Si/SiC Heterojunction von Sanchez, Ana M., Thomas, Stephen M., Pérez-Tomás, Amador, Jennings, Michael R., Gammon, Peter Michael, Fisher, Craig A., Donnellan, Benedict T., Mawby, Philip Andrew

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Innovative 3C-SiC on SiC via Direct Wafer Bonding von Thomas, Stephen M., Hamilton, D.P., Jennings, Michael R., Pérez-Tomás, Amador, Fisher, Craig, Gammon, Peter Michael, Severino, Andrea, Rong, Hua, Ward, Peter J., Bashir, Arif, Donnellan, Benedict T., Mawby, Philip Andrew

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Proposal for Requirements Driven Design Science Research von Braun, Richard, Benedict, Martin, Wendler, Hannes, Esswein, Werner

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Bow Free 4″ Diameter 3C-SiC Epilayers Formed upon Wafer-Bonded Si/SiC Substrates von Jennings, Michael R., Pérez-Tomás, Amador, Bashir, Arif, Sanchez, Ana, Severino, Andrea, Ward, Peter J., Thomas, Stephen M., Fisher, Craig, Gammon, Peter M., Zabala, Miguel, Burrows, Susan E., Donnellan, Benedict, Hamilton, Dean P., Walker, David, Mawby, Philip A.

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