Substrate Trenching Mechanism during Plasma and Magnetically Enhanced Polysilicon Etching von Van Nguyen, Son, Dobuzinsky, Dave, Stiffler, Scott R., Chrisman, Greg

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SELF-MATCHING CONTACT POINT PROCESS IN SEMICONDUCTOR MANUFACTURE, IMPROVING METHOD FOR STANDARD SELF- MATCHING CONTACT POINT SEMICONDUCTOR MANUFACTURE PROCESS AND SELF-MATCHING CON... von WITTMANN JUERGEN, DOBUZINSKY DAVE, WOLFGANG BERGNER, BRUNO SPULER

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Method of making a self-aligned contact von DOBUZINSKY, DAVE, SPULER, BRUNO, BERGNER, WOLFGANG, WITTMANN, JUERGEN

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Method of making a self-aligned contact von DOBUZINSKY, DAVE, SPULER, BRUNO, BERGNER, WOLFGANG, WITTMANN, JUERGEN

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A METHOD OF FORMING WIRES ON AN INTEGRATED CIRCUIT CHIP von OTANI, YOICHI, DOBUZINSKY, DAVE, SARDESAI, VIRAJ, RUPP, THOMAS, CLEVENGER, LAWRENCE, COSTRINI, GREG

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A METHOD OF FORMING WIRES ON AN INTEGRATED CIRCUIT CHIP von OTANI, YOICHI, DOBUZINSKY, DAVE, SARDESAI, VIRAJ, RUPP, THOMAS, CLEVENGER, LAWRENCE, COSTRINI, GREG

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Method of forming wires on an integrated circuit chip von DOBUZINSKY DAVE, CLEVENGER LAWRENCE, RUPP THOMAS, SARDESAI VIRAJ, OTANI YOICHI, COSTRINI GREG

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A METHOD OF FORMING WIRES ON AN INTEGRATED CIRCUIT CHIP von OTANI, YOICHI, DOBUZINSKY, DAVE, SARDESAI, VIRAJ, RUPP, THOMAS, CLEVENGER, LAWRENCE, COSTRINI, GREG

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Reduction of black silicon in semiconductor fabrication von PERNG, DUNGING, WISE, RICHARD S, DOBUZINSKY, DAVE M, WANG, TING-HAO

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