Treffer 1 - 5 von 5 für Suche 'Diop, Mamadou Diobet', Suchdauer: 0,45s Treffer weiter einschränken
  1. 1
    Evaluation of Anisotropic Conductive Films Based on Vertical Fibers for Post-CMOS Wafer-Level Packaging

    Evaluation of Anisotropic Conductive Films Based on Vertical Fibers for Post-CMOS Wafer-Level Packaging von Diop, M. D., Radji, M., Hamoui, A. A., Blaquiere, Y., Izquierdo, R.


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  2. 2
    Analysis of nickel cylindrical bump insertion into aluminium thin film for flip chip applications

    Analysis of nickel cylindrical bump insertion into aluminium thin film for flip chip applications von Diop, M.D., Mandrillon, V., Boutry, H., Inal, K., Fortunier, R.

    Veröffentlicht in Microelectronic engineering

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  3. 3
    Characterization of Microdevices by Nanoindentation

    Characterization of Microdevices by Nanoindentation von Diobet Diop, Mamadou

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  4. 4
    Interactions between Variable Frequency Microwave Underfill Processing and High Performance Packaging Materials

    Interactions between Variable Frequency Microwave Underfill Processing and High Performance Packaging Materials von Diop, Mamadou Diobet, Paquet, Marie-Claude, Drouin, Dominique, Danovitch, David


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  5. 5
    Void-Free Underfill Process With Variable Frequency Microwave for Higher Throughput in Large Flip Chip Package Application

    Void-Free Underfill Process With Variable Frequency Microwave for Higher Throughput in Large Flip Chip Package Application von Diop, Mamadou Diobet, Paquet, Marie-Claude, Danovitch, David, Drouin, Dominique


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