Numerical investigation of an evaporating meniscus in a channel von Dhavaleswarapu, Hemanth K., Murthy, Jayathi Y., Garimella, Suresh V.

Volltext

Mechanical Characterization of Thermal Interface Materials and Its Challenges von Subramanian, Vijay, Sanchez, Jorge, Bautista, Joseph, He, Yi, Wang, Jinlin, Das, Abhishek, Schuldes, Jesus Gerardo Reyes, Yazzie, Kyle, Dhavaleswarapu, Hemanth K, Malatkar, Pramod

Volltext

Experimental Investigation of Evaporation from Low-Contact-Angle Sessile Droplets von Dhavaleswarapu, Hemanth K, Migliaccio, Christopher P, Garimella, Suresh V, Murthy, Jayathi Y

Volltext

Temperature measurements near the contact line of an evaporating meniscus V-groove von Migliaccio, Christopher P., Dhavaleswarapu, Hemanth K., Garimella, Suresh V.

Volltext

Microscale Temperature Measurements Near the Triple Line of an Evaporating Thin Liquid Film von Dhavaleswarapu, Hemanth K., Garimella, Suresh V., Murthy, Jayathi Y.

Volltext

Experimental investigation of steady buoyant-thermocapillary convection near an evaporating meniscus von Dhavaleswarapu, Hemanth K., Chamarthy, Pramod, Garimella, Suresh V., Murthy, Jayathi Y.

Volltext

Visualization of convection patterns near an evaporating meniscus using μPIV von Chamarthy, Pramod, Dhavaleswarapu, Hemanth K., Garimella, Suresh V., Murthy, Jayathi Y., Wereley, Steven T.

Volltext

Visualization of convection patterns near an evaporating meniscus using ?PIV von Chamarthy, Pramod, Dhavaleswarapu, Hemanth K, Garimella, Suresh V, Murthy, Jayathi Y, Wereley, Steven T

Volltext

Visualization of convection patterns near an evaporating meniscus using μPIV: Selected papers from the 12th International Symposium on Flow Visualization von CHAMARTHY, Pramod, DHAVALESWARAPU, Hemanth K, GARIMELLA, Suresh V, MURTHY, Jayathi Y, WERELEY, Steven T

Volltext

MULTI-LEVEL DIE COUPLED WITH A SUBSTRATE von KARHADE, Omkar, VADLAMANI, Sai, DHAVALESWARAPU, Hemanth, BRUN, Xavier F

Volltext bestellen

Heat spreader edge standoffs for managing bondline thickness in microelectronic packages von Raravikar, Nachiket R, Jain, Syadwad, Dhavaleswarapu, Hemanth K, Beatty, John J, Thanu, Dinesh P. R

Volltext bestellen

Thermal management for flexible integrated circuit packages von Kumar Siddarth, Dhavaleswarapu Hemanth K

Volltext bestellen

CHIP PACKAGE WITH CORE EMBEDDED CHIPLET von STRAAYER, Matthew, BOYAPATI, Sri Ranga Sai, HARITSA, Manjunath D, DHAVALESWARAPU, Hemanth Kumar, KULKARNI, Deepak Vasant, NAFFZIGER, Samuel, PFEIFFENBERGER, Alexander Helmut, BURKHART, Justin Michael, SWAMINATHAN, Raja

Volltext bestellen

CHIP PACKAGE WITH CORE EMBEDDED CHIPLET von STRAAYER, Matthew, BOYAPATI, Sri Ranga Sai, HARITSA, Manjunath D, DHAVALESWARAPU, Hemanth Kumar, KULKARNI, Deepak Vasant, NAFFZIGER, Samuel, PFEIFFENBERGER, Alexander Helmut, BURKHART, Justin Michael, SWAMINATHAN, Raja

Volltext bestellen

THERMAL MANAGEMENT FOR FLEXIBLE INTEGRATED CIRCUIT PACKAGES von KUMAR, Siddarth, DHAVALESWARAPU, Hemanth K

Volltext bestellen

THERMAL MANAGEMENT FOR FLEXIBLE INTEGRATED CIRCUIT PACKAGES von Kumar Siddarth, Dhavaleswarapu Hemanth K

Volltext bestellen

HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC PACKAGES von Raravikar, Nachiket R, Jain, Syadwad, Dhavaleswarapu, Hemanth K, Beatty, John J, Thanu, Dinesh P. R

Volltext bestellen

Semiconductor package having sealant bridge von Li, Peng, Garner, Luke J, An, Yonghao, Cartas Ayala, Marco Aurelio, Dhavaleswarapu, Hemanth K, Padmanabhan Ramalekshmi Thanu, Dinesh, Beatty, John J, Guthikonda, Venkata Suresh

Volltext bestellen

Heat spreader edge standoffs for managing bondline thickness in microelectronic packages von Raravikar, Nachiket R, Jain, Syadwad, Dhavaleswarapu, Hemanth K, Beatty, John J, Thanu, Dinesh P. R

Volltext bestellen

Reduced expansion thermal compression bonding process bond head von Malatkar Pramod, Dhavaleswarapu Hemanth, Neeb James

Volltext bestellen