Microscale Temperature Measurements Near the Triple Line of an Evaporating Thin Liquid Film von Dhavaleswarapu, Hemanth K., Garimella, Suresh V., Murthy, Jayathi Y.

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Experimental investigation of steady buoyant-thermocapillary convection near an evaporating meniscus von Dhavaleswarapu, Hemanth K., Chamarthy, Pramod, Garimella, Suresh V., Murthy, Jayathi Y.

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Numerical investigation of an evaporating meniscus in a channel von Dhavaleswarapu, Hemanth K., Murthy, Jayathi Y., Garimella, Suresh V.

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Mechanical Characterization of Thermal Interface Materials and Its Challenges von Subramanian, Vijay, Sanchez, Jorge, Bautista, Joseph, He, Yi, Wang, Jinlin, Das, Abhishek, Schuldes, Jesus Gerardo Reyes, Yazzie, Kyle, Dhavaleswarapu, Hemanth K, Malatkar, Pramod

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Experimental Investigation of Evaporation from Low-Contact-Angle Sessile Droplets von Dhavaleswarapu, Hemanth K, Migliaccio, Christopher P, Garimella, Suresh V, Murthy, Jayathi Y

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Temperature measurements near the contact line of an evaporating meniscus V-groove von Migliaccio, Christopher P., Dhavaleswarapu, Hemanth K., Garimella, Suresh V.

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Visualization of convection patterns near an evaporating meniscus using μPIV von Chamarthy, Pramod, Dhavaleswarapu, Hemanth K., Garimella, Suresh V., Murthy, Jayathi Y., Wereley, Steven T.

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Visualization of convection patterns near an evaporating meniscus using ?PIV von Chamarthy, Pramod, Dhavaleswarapu, Hemanth K, Garimella, Suresh V, Murthy, Jayathi Y, Wereley, Steven T

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Visualization of convection patterns near an evaporating meniscus using μPIV: Selected papers from the 12th International Symposium on Flow Visualization von CHAMARTHY, Pramod, DHAVALESWARAPU, Hemanth K, GARIMELLA, Suresh V, MURTHY, Jayathi Y, WERELEY, Steven T

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Heat spreader edge standoffs for managing bondline thickness in microelectronic packages von Raravikar, Nachiket R, Jain, Syadwad, Dhavaleswarapu, Hemanth K, Beatty, John J, Thanu, Dinesh P. R

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Thermal management for flexible integrated circuit packages von Kumar Siddarth, Dhavaleswarapu Hemanth K

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THERMAL MANAGEMENT FOR FLEXIBLE INTEGRATED CIRCUIT PACKAGES von KUMAR, Siddarth, DHAVALESWARAPU, Hemanth K

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THERMAL MANAGEMENT FOR FLEXIBLE INTEGRATED CIRCUIT PACKAGES von Kumar Siddarth, Dhavaleswarapu Hemanth K

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HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC PACKAGES von Raravikar, Nachiket R, Jain, Syadwad, Dhavaleswarapu, Hemanth K, Beatty, John J, Thanu, Dinesh P. R

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Semiconductor package having sealant bridge von Li, Peng, Garner, Luke J, An, Yonghao, Cartas Ayala, Marco Aurelio, Dhavaleswarapu, Hemanth K, Padmanabhan Ramalekshmi Thanu, Dinesh, Beatty, John J, Guthikonda, Venkata Suresh

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Heat spreader edge standoffs for managing bondline thickness in microelectronic packages von Raravikar, Nachiket R, Jain, Syadwad, Dhavaleswarapu, Hemanth K, Beatty, John J, Thanu, Dinesh P. R

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Standoff spacers for managing bondline thickness in microelectronic packages von Deshmukh, Sachin, Dhavaleswarapu, Hemanth K, Beatty, John J, Thanu, Dinesh P. R

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Multiple-chip package with multiple thermal interface materials von Liu, Boxi, Matayabas, Jr., James C, Jain, Syadwad, Dhavaleswarapu, Hemanth K

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MULTIPLE-CHIP PACKAGE WITH MULTIPLE THERMAL INTERFACE MATERIALS von MATAYABAS, James C., Jr, LIU, Boxi, DHAVALESWARAPU, Hemanth K, JAIN, Syadwad

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HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC PACKAGES von RARAVIKAR, Nachiket R, THANU, Dinesh P. R, DHAVALESWARAPU, Hemanth K, BEATTY, John J, JAIN, Syadwad

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