Treffer 1 - 9 von 9 für Suche 'Descartin, Allen Marfil', Suchdauer: 0,30s Treffer weiter einschränken
  1. 1
    Lead-frame assembly, semiconductor package and methods for improved adhesion

    Lead-frame assembly, semiconductor package and methods for improved adhesion von Descartin, Allen Marfil, Ching, Jr., Mariano Layson, Li, Jun

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  2. 2
    LEAD-FRAME ASSEMBLY, SEMICONDUCTOR PACKAGE AND METHODS FOR IMPROVED ADHESION

    LEAD-FRAME ASSEMBLY, SEMICONDUCTOR PACKAGE AND METHODS FOR IMPROVED ADHESION von Descartin, Allen Marfil, Li, Jun, Ching Jr., Mariano Layson

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  3. 3
    LEAD-FRAME ASSEMBLY, SEMICONDUCTOR PACKAGE AND METHODS FOR IMPROVED ADHESION

    LEAD-FRAME ASSEMBLY, SEMICONDUCTOR PACKAGE AND METHODS FOR IMPROVED ADHESION von Descartin, Allen Marfil, Ching, JR., Mariano Layson, Li, Jun

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  4. 4
    Lead frame with selective patterned plating

    Lead frame with selective patterned plating von Descartin, Allen Marfil, Zhang, Lidong, Ching, Jr., Mariano Layson, Song, Meijiang, Li, Jun

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  5. 5
    Lead reduction for improved creepage distance

    Lead reduction for improved creepage distance von Descartin, Allen Marfil, Carpenter, Burton Jesse, Ching, Jr., Mariano Layson, Lee, Yit Meng, Liu, Jinmei

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  6. 6
    LEAD FRAME WITH SELECTIVE PATTERNED PLATING

    LEAD FRAME WITH SELECTIVE PATTERNED PLATING von Descartin, Allen Marfil, Zhang, Lidong, Ching, JR., Mariano Layson, Song, Meijiang, Li, Jun

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  7. 7
    LEAD REDUCTION FOR IMPROVED CREEPAGE DISTANCE

    LEAD REDUCTION FOR IMPROVED CREEPAGE DISTANCE von Descartin, Allen Marfil, CHING, JR., Mariano Layson, Carpenter, Burton Jesse, Lee, Yit Meng, Liu, Jinmei

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  8. 8
    Lead frame with selective pattern plating

    Lead frame with selective pattern plating von MARIANO LAYSON CHING JR, LI JUN, ZHANG LIDON, ALLEN MARFIL DESCARTIN, SONG MEIJIANG

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  9. 9
    Lead shortening to improve creepage distance

    Lead shortening to improve creepage distance von BURTON JESE CARPENTER, LEE YIT-MENG, MARIANO LAYSON CHING JR, LIU JINMEI, ALLEN MARFIL DESCARTIN

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