Assembly and Reliability of Very Large Flip-chip on CQFP von Clementi, J.J, Dearing, G.0, Bergeron, C

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A Systematic Evaluation of Factors Influencing TAB Inner Lead Reliability von Evans, H.E., Harvey, P.M., Dabroski, J.L., Dearing, G.O.

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Evolution of a unique flip-chip MCM-L package von Jimarez, M.A., Son Tran, Le Coz, C., Dearing, G.O.

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Reliability and analytical evaluations of no-clean flip-chip assembly von Clementi, J.J., Dearing, G.O., Zimmerman, J.A., Bergeron, C.

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