Relation between Raman frequency and triaxial stress in Si for surface and cross-sectional experiments in microelectronics components von De Wolf, Ingrid

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Novel technology for microlenses for imaging applications von Motsnyi, Vasyl, De Wolf, Ingrid, Rochus, Veronique, Rottenberg, Xavier, Cangar, Ozlem, Van Olmen, Jan, Guerrieri, Stefano, De Moor, Piet, Zahir, Mustapha

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A Novel Intermetallic Compound Insertion Bonding to Improve Throughput for Sequential 3-D Stacking von Hou, Lin, Derakhshandeh, Jaber, Capuz, Giovanni, Beyne, Eric, Wolf, Ingrid De

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Micro-Raman spectroscopy to study local mechanical stress in silicon integrated circuits von Wolf, Ingrid De

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A comprehensive model to predict the charging and reliability of capacitive RF MEMS switches von Spengen, W Merlijn van, Puers, Robert, Mertens, Robert, Wolf, Ingrid De

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Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits von Coenen, David, Oprins, Herman, Degraeve, Robin, Wolf, Ingrid De

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Analytical Markov Model to Calculate TDDB at Any Voltage and Temperature Stress Condition von Vici, Andrea, Degraeve, Robin, Franco, Jacopo, Kaczer, Ben, Roussel, Philippe J., De Wolf, Ingrid

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In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect von Hsu, Yung-Yu, Gonzalez, Mario, Bossuyt, Frederick, Axisa, Fabrice, Vanfleteren, Jan, Wolf, Ingrid De

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Study of damage and stress induced by backgrinding in Si wafers von Chen, Jian, Wolf, Ingrid De

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Three-dimensional micro-Raman spectroscopy mapping of stress induced in Si by Cu-filled through-Si vias von Kosemura, Daisuke, De Wolf, Ingrid

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Impact of Externally Induced Local Mechanical Stress on Electrical Performance of Decananometer MOSFETs von Lee, Kookjin, Kaczer, Ben, Kruv, Anastasiia, Gonzalez, Mario, Eneman, Geert, Okudur, Oguzhan Orkut, Grill, Alexander, De Wolf, Ingrid

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Advanced Current-Voltage Model of Electrical Contacts to GaAs-and Ge-Based Active Silicon Photonic Devices von Hsieh, Ping-Yi, O'Sullivan, Barry, Tsiara, Artemisia, Truijen, Brecht, Lagrain, Pieter, Wouters, Lennaert, Yudistira, Didit, Kunert, Bernardette, Campenhout, Joris Van, Wolf, Ingrid De

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Low-frequency noise and thermal equilibrium properties of vacancies von Beyne, Sofie, Wolf, Ingrid De, Tőkei, Zsolt, Croes, Kristof

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Expected Failures in 3-D Technology and Related Failure Analysis Challenges von De Wolf, Ingrid, Croes, Kristof, Beyne, Eric

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Polyimide-Enhanced Stretchable Interconnects: Design, Fabrication, and Characterization von Yung-Yu Hsu, Gonzalez, M., Bossuyt, F., Vanfleteren, J., De Wolf, I.

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Influence of Field-Plate Configuration on Power Dissipation and Temperature Profiles in AlGaN/GaN on Silicon HEMTs von Sodan, Vice, Oprins, Herman, Stoffels, Steve, Baelmans, Martine, De Wolf, Ingrid

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A novel electromigration characterization method based on low-frequency noise measurements von Beyne, Sofie, Pedreira, Olalla Varela, Wolf, Ingrid De, T kei, Zsolt, Croes, Kristof

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A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects von Saleh, Ahmed Sobhi, Croes, Kristof, Ceric, Hajdin, De Wolf, Ingrid, Zahedmanesh, Houman

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A Critical Analysis of the Thermo-Optic Time Constant in Si Photonic Devices von Coenen, David, Kim, Minkyu, Oprins, Herman, Van Campenhout, Joris, De Wolf, Ingrid

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The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects von Hsu, Yung-Yu, Gonzalez, Mario, Bossuyt, Frederick, Axisa, Fabrice, Vanfleteren, Jan, De Wolf, Ingrid

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