Line-to-Line TDDB Modeling: LER Specs for Sub-20-nm Pitch Interconnects von Fang, Yu, Ciofi, I., Roussel, Ph. J., Lesniewska, A., Degraeve, R., Wolf, I. De, Croes, K.

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Printed circuit board technology inspired stretchable circuits von Vanfleteren, J., Gonzalez, M., Bossuyt, F., Hsu, Y.-Y., Vervust, T., De Wolf, I., Jablonski, M.

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Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects von Panchenko, Iuliana, Croes, Kristof, De Wolf, I., De Messemaeker, J., Beyne, Eric, Wolter, Klaus-Juergen

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Mechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-)MEMS devices von Jourdain, A, De Moor, P, Baert, K, De Wolf, I, Tilmans, H A C

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Risk-based educational accountability in Dutch primary education von Timmermans, A. C., de Wolf, I. F., Bosker, R. J., Doolaard, S.

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Nozzle scaling effects for the thermohydraulic performance of microjet impingement cooling with distributed returns von Wei, T.-W., Oprins, H., Fang, Liang, Cherman, V., De Wolf, I., Beyne, E., Baelmans, M.

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A methodology for mechanical stress and wafer warpage minimization during 3D NAND fabrication von Kruv, A., Gonzalez, M., Okudur, O.O., Spampinato, V., Franquet, A., Palayam, S.V., Arreghini, A., Van den bosch, G., Rosmeulen, M., De Wolf, I.

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Creep-resistant aluminum alloys for use in MEMS von Modlinski, R, Ratchev, P, Witvrouw, A, Puers, R, De Wolf, I

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An electrostatic fringing-field actuator (EFFA): application towards a low-complexity thin-film RF-MEMS technology von Rottenberg, X, Brebels, S, Ekkels, P, Czarnecki, P, Nolmans, P, Mertens, R P, Nauwelaers, B, Puers, R, De Wolf, I, De Raedt, W, Tilmans, H A C

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Fast and Distributed Thermal Model for Thermal Modeling of GaN Power Devices von Sodan, V., Stoffels, S., Oprins, H., Decoutere, S., Altmann, F., Baelmans, M., De Wolf, I.

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Analytical Model of the DC Actuation of Electrostatic MEMS Devices With Distributed Dielectric Charging and Nonplanar Electrodes von Rottenberg, X., De Wolf, I., Nauwelaers, B.K.J.C., De Raedt, W., Tilmans, H.A.C.

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Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures von Dimcic, B., Labie, R., De Messemaeker, J., Vanstreels, K., Croes, K., Verlinden, B., De Wolf, I.

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Materials issues in the processing, the operation and the reliability of MEMS von Witvrouw, A., Tilmans, H.A.C., De Wolf, I.

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A physical model to predict stiction in MEMS von Spengen, W Merlijn van, Puers, Robert, Wolf, Ingrid De

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Techniques for mechanical strain analysis in sub-micrometer structures: TEM/CBED, micro-Raman spectroscopy, X-ray micro-diffraction and modeling von De Wolf, I, Senez, V, Balboni, R, Armigliato, A, Frabboni, S, Cedola, A, Lagomarsino, S

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Influence of process-induced stress on device characteristics and its impact on scaled device performance von Smeys, P., Griffin, P.B., Rek, Z.U., De Wolf, I., Saraswat, K.C.

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Anisotropic stress in narrow sGe fin field-effect transistor channels measured using nano-focused Raman spectroscopy von Nuytten, T., Bogdanowicz, J., Witters, L., Eneman, G., Hantschel, T., Schulze, A., Favia, P., Bender, H., De Wolf, I., Vandervorst, W.

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Creep characterization of Al alloy thin films for use in MEMS applications von Modlinski, R., Witvrouw, A., Ratchev, P., Puers, R., Toonder, J.M.J. den, Wolf, I. De

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B-Spline X-Ray Diffraction Imaging — Rapid non-destructive measurement of die warpage in ball grid array packages von Cowley, A., Ivankovic, A., Wong, C.S., Bennett, N.S., Danilewsky, A.N., Gonzalez, M., Cherman, V., Vandevelde, B., De Wolf, I., McNally, P.J.

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In-situ scanning electron microscope observation of electromigration-induced void growth in 30 nm ½ pitch Cu interconnect structures von Vanstreels, K., Czarnecki, P., Kirimura, T., Siew, Y. K., De Wolf, I., Bömmels, J., Tőkei, Zs, Croes, K.

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