Microwave characterization of porous SiOCH permittivity after integration dedicated to the 32 nm node von Blampey, B., Gallitre, M., Farcy, A., Lacrevaz, T., De Rivaz, S., Bermond, C., Fléchet, B., Jousseaume, V., Zenasni, A., Ancey, P.

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Performance analysis of LDR UWB non-coherent receivers in multipath environments von Dubouloz, S., Denis, B., de Rivaz, S., Ouvry, L.

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"Characterization and Modelling of Substrate Coupling Effects in 3D Integrated Circuit Stacking" von Eid, E., Lacrevaz, T., Bermond, C., de Rivaz, S., Capraro, S., Roullard, J., Cadix, L., Fléchet, B., Farcy, A., Ancey, P., Calmon, F., Valorge, O., Leduc, P.

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Keep on shrinking interconnect size: Is it still the best solution? von Deschacht, D, de Rivaz, S, Farcy, A, Lacrevaz, T, Flechet, B

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Effective interconnect networks design in CMOS 45 nm circuits to joint reductions of XT and delay for transmission of very high speed signals von de Rivaz, S, Farcy, A, Deschacht, D, Lacrevaz, T, Flechet, B

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Microwave characterization of porous SiOCH permittivity after integration dedicated to the 32nm node von Blampey, B., Gallitre, M., Farcy, A., Lacrevaz, T., De Rivaz, S., Bermond, C., Fléchet, B., Jousseaume, V., Zenasni, A., Ancey, P.

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"Microwave characterization of porous SiOCH permittivity after integration dedicated to the 32 nm node" von Blampey, B., Gallitre, M., Farcy, A., Lacrevaz, T., de Rivaz, S., Bermond, C., Fléchet, B., Jousseaume, V., Zenasni, A., Ancey, P.

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Benefit on interconnect performance of a relaxed wire density in a 45 nm node of the Back End of Line von de Rivaz, S, Farcy, A, Deschacht, D, Lacrevaz, T, Flechet, B

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Characterization and modeling of RF substrate coupling effects due to vertical interconnects in 3D integrated circuit stacking von Eid, E, Lacrevaz, T, Bermond, C, de Rivaz, S, Capraro, S, Roullard, J, Cadix, L, Fléchet, B, Farcy, A, Ancey, P, Calmon, F, Valorge, O, Leduc, P

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Performances analysis of a UWB receiver using complex processing von de Rivaz, S., Denis, B., Keignart, J., Pezzin, M., Daniele, N., Morche, D.

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Performance analysis of low complexity solutions for UWB low data rate impulse radio von Dubouloz, S., Rabbachin, A., de Rivaz, S., Denis, B., Ouvry, L.

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Ultra wideband: the radio link of the future? von Pezzin, Manuel, Keignart, Julien, Daniele, Norbert, Rivaz, Sébastien de, Denis, Benoît, Morche, Dominique, Rouzet, Philippe, Catenoz, Régis, Rinaldi, Nils

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Performance of IEEE 802.15.4a UWB Systems Under Multi-User Interference von de Rivaz, S., Denis, B., Pezzin, M., Ouvry, L.

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Rise time reduction of high speed digital signals on interconnects of the CMOS 45 nm node by optimizing interconnect inductance von de Rivaz, S., Lacrevaz, T., Bermond, C., Flechet, B., Farcy, A.

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Impact of ULK Dielectric Loss on Interconnect Response for 45 nm Node Integrated Circuits von de Rivaz, S., Lacrevaz, T., Gallitre, M., Farcy, A., Blampey, B., Bermond, C., Flechet, B.

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Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking von Eid, E., Lacrevaz, T., de Rivaz, S., Bermond, C., Flechet, B., Calmon, F., Gontrand, C., Farcy, A., Cadix, L., Ancey, P.

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Dielectric Loss Effects on the Modeling of Interconnect Responses for the 45 nm Node von de Rivaz, S., Lacrevaz, T., Gallitre, M., Farcy, A., Blampey, B., Bermond, C., Flechet, B.

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Alice Rivaz (Ecrivain) von Olivier Frei

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Inverted and vertical climbing of a quadrupedal microrobot using electroadhesion von de Rivaz, Sébastien D, Goldberg, Benjamin, Doshi, Neel, Jayaram, Kaushik, Zhou, Jack, Wood, Robert J

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Single chamber multiple degree-of-freedom soft pneumatic actuator enabled by adjustable stiffness layers von Santoso, Junius, Skorina, Erik H, Salerno, Marco, de Rivaz, Sébastien, Paik, Jamie, Onal, Cagdas D

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