Thermal Pathfinding for 3-D ICs von Priyadarshi, Shivam, Davis, W. Rhett, Steer, Michael B., Franzon, Paul D.

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Exploring compromises among timing, power and temperature in three-dimensional integrated circuits von Hua, Hao, Mineo, Chris, Schoenfliess, Kory, Sule, Ambarish, Melamed, Samson, Jenkal, Ravi, Davis, W. Rhett

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Automated Design Space Exploration for DSP Applications von Hourani, Ramsey, Jenkal, Ravi, Davis, W. Rhett, Alexander, Winser

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Creating 3D specific systems: Architecture, design and CAD von Franzon, Paul D, Davis, W Rhett, Thorolffson, Thor

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A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits von Harris, T. R., Priyadarshi, S., Melamed, S., Ortega, C., Manohar, R., Dooley, S. R., Kriplani, N. M., Davis, W. R., Franzon, P. D., Steer, M. B.

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A design environment for high-throughput low-power dedicated signal processing systems von Davis, W.R., Zhang, N., Camera, K., Markovic, D., Smilkstein, T., Ammer, M.J., Yeo, E., Augsburger, S., Nikolic, B., Brodersen, R.W.

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Inter-die signaling in three dimensional integrated circuits von Mineo, C., Jenkal, R., Melamed, S., Davis, W.R.

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Thermal analysis and verification of a mounted monolithic integrated circuit von Harris, T Robert, Melamed, Samson, Luniya, Sonali, Davis, W Rhett, Steer, Michael B, Doxsee, Lawrence E, Obermiller, Kurt, Hawkinson, Chad

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An efficient VLSI implementation for the 1D convolutional discrete wavelet transform von Hourani, R., Dalal, I., Davis, W.R., Doss, C., Alexander, W.

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Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring von Melamed, S., Thorolfsson, T., Harris, T. R., Priyadarshi, S., Franzon, P., Steer, M. B., Davis, W. R.

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Compact Electrothermal Modeling of an X-band MMIC von Luniya, S., Batty, W., Caccamesi, V., Garcia, M., Christoffersen, C., Melamed, S., Rhett Davis, W., Steer, M.

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Parallel Transient Simulation of Multiphysics Circuits Using Delay-Based Partitioning von Priyadarshi, S., Saunders, C. S., Kriplani, N. M., Demircioglu, H., Davis, W. R., Franzon, P. D., Steer, M. B.

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Low-Power Hypercube Divided Memory FFT Engine Using 3D Integration von Thorolfsson, Thorlindur, Melamed, Samson, Davis, W. Rhett, Franzon, Paul D.

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Application Exploration for 3-D Integrated Circuits: TCAM, FIFO, and FFT Case Studies von Davis, W.R., Oh, E.C., Sule, A.M., Franzon, P.D.

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Low-Power Hypercube Divided Memory FFT Engine Using 3D Integration von Thorolfsson, Thorlindur, Melamed, Samson, Davis, W Rhett, Franzon, Paul D

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A 500-Mb/s soft-output Viterbi decoder von Engling Yeo, Augsburger, S.A., Davis, W.R., Nikolic, B.

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Development of a Predictive Process Design kit for15-nm FinFETs: FreePDK15 von Bhanushali, Kirti, Tembe, Chinmay, Davis, W. Rhett

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Exploring early design tradeoffs in 3DIC von Franzon, Paul D., Priyadarshi, Shivam, Lipa, Steve, Davis, W. Rhett, Thorolfsson, Thor

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Application Exploration for 3-D Integrated Circuits: TCAM, FIFO, and FFT Case Studies : Nanocircuits and systems von RHETT DAVIS, W, EUN CHU OH, SULE, Ambarish M, FRANZON, Paul D

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3D Specific Systems: Design and CAD von Franzon, P. D., Davis, W. R., Thorolfsson, T., Melamed, S.

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